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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 261-263 (Apr. 2004), p. 675-680 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Three kinds of fracture specimens are tested under different constraint conditions. One is 3PB(Three Point Bending) specimen, another is CCT(Center Cracked Tension) specimen, and the third one is called CCB(Center Cracked Bending) specimen. By the SEM (Scanning Electron Microscope) observation, it is shown that the roughness of fracture surface is different from each other largely. They are the effect of constraint condition. The dimple fracture process is simulated by the finite element method using Gurson's constitutive equation, and the crack tip stress fields are obtained. The distributions of stress triaxiality components are qualitatively agree with the experimental results. The J-R curves obtained also qualitatively agree with those of experiments, and the fracture surface roughness is well simulated
    Type of Medium: Electronic Resource
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