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  • 1
    Electronic Resource
    Electronic Resource
    Thermal cycling reliability of lead-free chip resistor solder joints (2004)
    Bradford : Emerald
    Soldering & surface mount technology 16 (2004), S. 77-87 
    Details
    ISSN: 0954-0911
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to harsh environments. In this work, the thermal cycling reliability of several 2512 chip resistor lead-free solder joint configurations has been investigated. In an initial study, a comparison has been made between the solder joint reliabilities obtained with components fabricated with both tin-lead and pure tin solder terminations. In the main portion of the reliability testing, two temperature ranges (-40-125°C and -40-150°C) and five different solder alloys have been examined. The investigated solders include the normal eutectic Sn-Ag-Cu (SAC) alloy recommended by earlier studies (95.5Sn-3.8Ag-0.7Cu), and three variations of the lead-free ternary SAC alloy that include small quaternary additions of bismuth and indium to enhance fatigue resistance.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/09540910410537354
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    Paper (German National Licenses)
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  • 2
    Electronic Resource
    Electronic Resource
    Thermal cycle reliability of solder joints to alternate plating finishes (1999)
    Bradford : Emerald
    Circuit world 25 (1999), S. 27-30 
    Details
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Studies immersion gold over electroless nickel, immersion gold over electroless palladium, immersion gold over electroless palladium over electroless nickel, immersion gold over immersion silver and immersion silver. In the palladium finishes, two palladium thicknesses were evaluated: 10-12µin. and 18-20µin. Multiple plating chemistry suppliers provided plated test vehicles. HASL and OSP test vehicles were included as control samples. In total, 14 finishes were evaluated in the test matrix. The test vehicle was a daisy chain of zero ohm 1,206 chip resistors that could be monitored individually. Test vehicles were assembled using 63Sn/37Pb eutectic solder paste on an automated assembly line. The thermal cycle range was -40°C to 125°C with 30-minute transition times and 15 minutes at each extreme in a single chamber air system. For each test matrix cell, 120 zero ohm resistors (40 from three boards) were continuously monitored for electrical failure (〉100ohms). In addition, resistors were sheared from test vehicles and the shear force at failure was recorded. A decrease in shear force did occur with thermal cycling due to crack initiation and growth in the solder joints. Solder joint cracks have also been examined.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/03056129910258306
    Library Location Call Number Volume/Issue/Year Availability
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    Paper (German National Licenses)
    Fulltext
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