ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The aim of this paper is to describe a failure analysis methodology applicable to revealthe root causes of electronic assembly failures. The most relevant properties of the appliedtechniques, i.e. optical microscopy, X-ray microstructure analysis, SEM (scanning electronmicroscopy) combined with EDX (energy dispersive X-ray spectroscopy) analysis, are given. Threerecent failure analysis case studies are also presented. In case of a burnt component the microwireand the leadframe formed AlCu intermetallic compound in the length of several millimeters. Thelow joint strength of gullwing leads were deduced back to paste printing and wetting problems. Thefracture surface morphology of a joint broken on the field showed different structure from the onesbroken at room temperature. It was revealed that SnPb solder fracture surface is different at roomtemperature and above 100°C
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/19/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.589.349.pdf
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