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  • 1
    Electronic Resource
    Electronic Resource
    Oxford, UK : Blackwell Publishing Ltd
    Journal of food process engineering 2 (1978), S. 0 
    ISSN: 1745-4530
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Process Engineering, Biotechnology, Nutrition Technology
    Notes: Effects of moisture level, temperature and shear rate on the rheological properties of defatted soy dough during extrusion were studied on a Brabender laboratory extruder. Entrance pressure loss through the extruder capillary die as well as viscosity of the cooked and compressed soy dough were expressed as a function of added moisture, shear rate and temperature through multiple regression analysis. Process conditions involved in this study were (a) temperature from 100 to 160°C; (b) added moisture from 22 to 32% and (c) shear rate from 50 to 10,500 sec−1. Data were collected at steady state. It was found that in the shear rate range of 50 to 1,000 sec−1 and temperature range of 100 to 160°C the viscosity of the cooked and compressed soy dough with 32%, 25% and 22% added moisture ranged from 10,000 to 500 poise and 20,000 to 200 poise and 20,000 to 1,000 poise respectively.
    Type of Medium: Electronic Resource
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