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  • 1
    Electronic Resource
    Electronic Resource
    Glass transition of atactic polystyrene with less chain entanglements (1995)
    Springer
    Polymer bulletin 35 (1995), S. 209-214 
    Details
    ISSN: 1436-2449
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Summary Atactic polystyrene was dissolved and refluxed in benzene keeping the polymer concentration well below the critical concentration C* value for chain overlap. After rapid freezing of the solution by injecting it directly into liquid nitrogen, the solvent was sublimated so that the expanded chain coils with few entanglements could be obtained. Tg for this material was found to be 11 K lower than the normal polystyrene even after annealing up to 470 K. Comparison of the infrared spectra shows some conformational differences between the freeze-dried and the normal PS. Upon shock-cooling and subsequent freeze-drying, all vibrational bands appear much sharper, indicating an increase in structure regularity.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00312916
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  • 2
    Electronic Resource
    Electronic Resource
    A study of glass fiber-epoxy composite interfaces (1989)
    Brookfield, Conn. : Wiley-Blackwell
    Polymer Composites 10 (1989), S. 424-428 
    Details
    ISSN: 0272-8397
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Fourier transform infrared spectroscopy was utilized to characterize the interfacial bonding in glass-fiber-reinforced composites. The pH of the treating solution significantly affects the interfacial chemical bonding. The natural pH of the solution gives the maximum interfacial bonding. The decrease of the interfacial bonding is due to the side reactions that occur when NaOH or HCl is added to the solution. The temperature of the curing process has little effect on the amount of the interfacial chemical bonding. We attribute this to the reaction rate constant of the interfacial reaction being much larger than that of the epoxy polymerization. From the hygrothermal behavior, we have found the amount of silane needed for hygrothermal condition is different from that for dry condition.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pc.750100606
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    Paper (German National Licenses)
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