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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 353-358 (Sept. 2007), p. 711-714 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The dependence on the grain orientation of the alignment of planar dislocationboundaries in plastically deformed metals has been investigated by examining grains of Sorientation ({123}〈63-4〉) in cold-rolled polycrystalline aluminum. For the ideal S orientation the{111} slip plane associated with the highest resolved shear stress lies either at +40° or -40° to therolling direction in the longitudinal section, with two S variants corresponding to each case.Boundary traces in S orientation grains in the rolled sample were examined by the combined use ofelectron channeling contrast imaging and electron backscatter diffraction orientation mapping. Ineach case the +/- sense of the observed planar boundary traces matched that of the {111} slip planewith the highest resolved shear stress showing that the alignment of the boundaries ispredominantly controlled by crystallographic rather than macroscopic considerations
    Type of Medium: Electronic Resource
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