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  • 1
    Electronic Resource
    Electronic Resource
    Synthesis and characterization of siloxane-modified epoxy resin (1994)
    Springer
    Journal of polymer research 1 (1994), S. 151-162 
    Details
    ISSN: 1572-8935
    Keywords: Sulfone-epoxy EBS ; Silopane-epoxy ESBS ; SEM/EDX ; Compatibility ; Immiscibility
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract Epoxy resins of the EBS, a bis-p-phenol S modified diglycidyl ether of bis-p-phenol A and the ESBS, a siloxane modified EBS epoxy resin were prepared. Both structures of EBS and ESBS were elucidated with IR,1H NMR, and13C NMR. The near perpendicular comformation of two phenyl rings of sulfone has been introduced into the epoxy resins of EBS und ESBS for Me increase of Me Tg. Some curing and thermal characteristics of these modified EBS and ESBS epoxy resins were studied. The curing patterns of ESBS and ESBS indicated the similarity with that of the DGEBA epoxy resins. Tg measurements resulted an increasing order of We ESBS (Tg of 141 °C), EBS (Tg of 135 °C) and then followed by Epons 1004 (Tg of 104 °C), 1001 (Tg of 101 °C) and 828 (Tg of 100 °C) in samples tested under the same conditions. Thus the substantial improvement of the thermal stability of the modified epoxy resins was indicated. Compatibility characteristics of the EBS and ESBS as indicated by the SEM/EDS is that an ESBS up to 30 % of the siloxane content was found to be compatible but not miscible with the Epon, a phenolic epoxy resin of DGEBA.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01374090
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  • 2
    Electronic Resource
    Electronic Resource
    Synthesis and impact properties of siloxane-DGEBA epoxy copolymers (1996)
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part A: Polymer Chemistry 34 (1996), S. 1907-1922 
    Details
    ISSN: 0887-624X
    Keywords: siloxane-DGEBA ; PMPS ; PDMS ; impact improvement ; thermal stability ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Siloxane-incorporated epoxy (ESDG) copolymers were prepared by a hot-melt method. IR, 1H- and 13C-NMR are used to determine the structures. The data on the molecular properties indicate that reaction proceeded with a random polycondensation without involving the opening of the oxirane ring in the epoxy structure. Lowering Tgs with increasing siloxane content in copolymers are observed except for the copolymer modified with PDMS siloxane oligomer. Thermal stability data indicate that siloxane moiety exerts its thermal stability on the copolymer through dissipation of the heat, thus delaying thermal degradation of copolymers. Increasing impact strengths in J/M in the range of 22.0-59.0 are observed for copolymers and the improvement of the impact strength is closely related to the structure and content of siloxane oligomers in copolymers. A rough surface was observed by SEM examination on the propagation surface of the copolymeric impact specimen, while a smooth surface is observed on the unmodified epoxy specimen. The EDX analysis reveals these protruded features are Si-rich segments. The morphological observations suggest the siloxane segment may act as a toughening agent in the epoxy networks, thus contributing to the impact improvement of the copolymers. © 1996 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 34:1907-1922, 1996
    Additional Material: 13 Ill.
    Type of Medium: Electronic Resource
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    Paper (German National Licenses)
  • 3
    Electronic Resource
    Electronic Resource
    Preparation and structural determination of siloxane-modified sulfone-containing epoxy resins (1996)
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part A: Polymer Chemistry 34 (1996), S. 869-884 
    Details
    ISSN: 0887-624X
    Keywords: hot-melt polycondensation ; siloxane-modified sulfone-containing epoxy resin ; PMPS ; PDMS ; Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Siloxane-modified sulfone-containing epoxy resins (ESBS) were prepared by polycondensation of PMPS and/or PDMS siloxane oligomers with EBS, the sulfone-containing epoxy resin. Structures were analyzed by IR, 1H-, and 13C-NMR. The siloxane content in the copolymers was determined by 1H-NMR with an integration technique. Epoxy equivalent weight (EEW) determination indicated that the oxirane ring of EBS was intact with this hot-melt procedure. The GPC measurement of these ESBS copolymers showed that molecular weight (MW) increased with increasing siloxane content in PMPS-modified copolymers. Evidence of siloxane incorporation in the copolymer was discussed. © 1996 John Wiley & Sons, Inc.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Study of curing kinetics of siloxane-modified dgeba epoxy resins (1996)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 62 (1996), S. 1641-1649 
    Details
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The curing kinetics of some epoxy resins of siloxane-modified diglycidyl ether of bisphenol A (ESDG) were studied by the dynamic differential scanning calorimetry method. The curing kinetic parameters are calculated by using the Ozawa method and are further verified by the Kissinger method. The results indicate a first-order curing kinetics for ESDG. The curing characteristics of ESDG have been observed to be influenced by the phenyl content of the siloxanes. The curing activation energies in the range of 80.3 to 88.1 KJ mol-1 are obtained for these ESDG. The thermograms indicate that the ESDG exhibits a slightly higher initial temperature, as well as peak temperature, but a significantly narrower curing temperature range. The reason for the narrow curing temperature range may due to the low concentration of —OH group in the ESDG, and thus little process of ether linkage is taken place in the curing process. This suggests that ESDG can be cured more efficiently than the normal DGEBA epoxy resins. © 1996 John Wiley & Sons, Inc.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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