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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 1518-1524 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Epitaxial tetragonal and hexagonal MoSi2 (t-MoSi2 and h-MoSi2) were grown locally in (001), (111), and (011)Si. Five different epitaxial modes, referring to sets of definite orientation relationships between silicides and the substrate Si, were identified for t-MoSi2, whereas three distinct modes were found for h-MoSi2. Variants of epitaxy, required by the symmetry consideration, were also observed. It is conceived that ample thermal energy was supplied during high-temperature annealings to cause various modes of epitaxy which presumably correspond to low-energy states that occur. The reactive nature of the silicide formation is suggested to facilitate the growth of epitaxial silicides on silicon.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 3481-3488 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Epitaxial growth of both tetragonal and hexagonal WSi2 in silicon was investigated by transmission electron microscopy. Eight different modes of WSi2 epitaxy were found to grow in (001), (111), and (011) Si. Variants of WSi2 epitaxy were also observed. Crystallographic analyses were performed to find possible matches between atoms in overlayer and silicon at WSi2/Si interfaces. Interfacial structures were analyzed. The roles of the lattice match in the growth of epitaxial WSi2 and MoSi2, which are similar in various aspects, are explored. The effects of anharmonicity in the interatomic force of overlayer on the heteroepitaxial growth and pseudomorphism are discussed.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 85 (1999), S. 3339-3344 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: P-Si(100) and n-Si(100) substrates had quite different responses to the same process parameters used in the modified four-step diamond growth method, i.e., pretreatment, heating, bias enhanced nucleation (BEN) and bias texture growth (BTG), which has been developed to grow textured diamond films by hot filament chemical vapor deposition. At the pretreatment step, a bright blue plasma discharge induced the formation of damaged voids randomly distributed on the surfaces of p-Si(100) and n-Si(100). The damaged voids on p-Si(100) are several microns in size and 3 μm in depth. In contrast, the size and depth of the damaged voids on n-Si(100) are in nanometer scale, approximately two orders of magnitude lower than those on p-Si(100). At the BEN step, carburization occurred along with the possibility of diamond nucleation. Unfacet nuclei of micron scale distributed around the edge of damaged voids all over the p-Si(100) substrate. In contrast, a great number of small nuclei of nanometer scale spread and covered all the damaged voids around the outer edge of the n-Si(100) substrate. The continuous textured diamond film grown on p-Si(100) had better diamond quality than that on n-Si(100) at the BTG step. The textured diamond film on p-Si(100) was flat, however, that on n-Si(100) was under stress in convex shape. Ion bombardment at the BTG step resulted in the enhancement of the growth of textured diamond and in the degradation of diamond quality through the formation of amorphous carbon. P-Si(100) is considered better than n-Si(100) to be the substrate for textured diamond deposition. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 58 (1985), S. 1515-1518 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Both epitaxial tetragonal and hexagonal WSi2 (t-WSi2 and h-WSi2) were grown locally on (111)Si. The best epitaxy was obtained in 600–1100 °C two-step annealed samples. The orientation relationships between t-WSi2 and Si are [110]WSi2(parallel)[111]Si and (004)WSi2(parallel)(2¯02), whereas those between h-WSi2 and Si are [0001]WSi2(parallel)[111]Si and (202¯0)WSi2(parallel)(202¯)Si. Interfacial dislocations, 80 A(ring) in spacing, were identified to be of edge type with (1/6)〈112〉 Burgers vectors. Two step annealings were found to be effective in improving the epitaxy and relieving the island formation of WSi2 on Si. Significant intermixing of W and Si atoms during the preannealing is proposed to account for the effects.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 28 (1993), S. 781-784 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract TheT c changes related to the microstructure as a function of annealing temperature for the BiSrCaCuO (BSCCO) film implanted with 170 keV P+ at two different doses were studied. The BSCCO films were prepared by d.c. sputtering on MgO substrates. For the film implanted at a dose of 5×1015 cm−2 post-implantation annealing at 600–800°C enabled theT cs of the film to be completely recovered. For the film implanted at a dose of 1.0×1017cm−2 theT cs were only partly recovered after 600°C annealing. On further annealing at 700°C the superconductivity of the film disappeared. TEM examination showed that significant amount of CaP, Ca3P2, and some unknown phases were formed. It is considered that the significant amounts of these phases formed during post-implantation annealing renders the recovery of the superconductivity of the P+-implanted BSCCO film difficult.
    Type of Medium: Electronic Resource
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