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  • 1
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 70 (1997), S. 2353-2355 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: We report photoluminescence from Si1−x−yGexCy films grown epitaxially on Si (100) by chemical vapor deposition. We observe significant energy shifts but no dramatic changes in the photoluminescence line shape caused by the presence of carbon. Using standard deformation potential theory to correct the epitaxial strain shifts, we conclude that the band gap of relaxed Si1−x−yGexCy alloys has a lower energy than the band gap of relaxed Si1−xGex with the same Si/Ge ratio. We propose an explanation of these results based on the assumption that carbon forms a resonant level within the conduction band of Si1−xGex. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 6164-6180 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A characterization technique was developed for measuring the complete tensor nature of stress fields in semiconductors. By combining incident light tilted away from the normal axis with polarization of the incident and scattered beams, any Raman-active optical phonon mode can be selectively studied. Once the frequencies and intensities of these phonons are known, the complete stress tensor can be determined. Using this concept, a general, systematic theory and methodology for implementing polarized off-axis Raman spectroscopy was developed that took into account realistic effects which would be encountered in an actual experiment. This methodology was applied to mechanically deformed silicon wafers. By applying loads in different configurations across the wafer, various types of stress were created including tension, compression, and shear. The polarized off-axis Raman technique was validated by comparing its results to both analytic calculations based upon the theory of elasticity and to direct measurements of the wafer curvature using a laser deflection method. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 66 (1995), S. 3639-3641 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Polarized off-axis Raman spectroscopy is a technique for measuring the complete tensor nature of stress fields in semiconductors. By combining incident light tilted away from the normal axis with polarization of the incident and scattered beams, any Raman-active optical phonon mode can be selectively studied. Once the frequencies and intensities of these phonons are measured, the complete stress tensor can be uniquely determined. This technique has been applied macroscopically to mechanically deformed silicon wafers under biaxial tension. The results of this approach compare favorably with the stress calculated by means of the theory of elasticity. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Boron concentration profiles in rapid thermally annealed Si and strained Si1−xGex in situ doped, epitaxial layers were measured using secondary-ion-mass spectroscopy. Comparison of the Si1−xGex samples to the Si samples after rapid thermal annealing revealed a retarded B diffusivity inside the strained Si1−xGex layers. A simple empirical expression for the B retardation, which depended linearly on the Ge concentration, was developed and incorporated into a diffusion model for dopants in heterostructures. This model accurately simulated the measured B concentration profiles over a wide range of Ge fractions (0%–10%), B peak concentrations (2×1018–3×1019cm−3), and rapid thermal annealing conditions (900–1025 °C for 20–30 s).
    Type of Medium: Electronic Resource
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