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  • 1
    ISSN: 1532-849X
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Medicine
    Notes: Purpose This study evaluated the tensile bond strength of a bisphenol glycidyl methacrylate (Bis-GMA) resin luting cement with four different surface treatments of a high Pd-Cu alloy.Materials and Methods For each surface treatment type (tin-plated, porcelain furnace oxide, air-abraded, and finished-only), 15 opposing half-dumbbell-shaped samples were cast and prepared in new Pd?Cu alloy. Samples were luted with a Bis-GMA resin luting cement at a film thickness of 80 μm using a custom alignment apparatus. Samples were stored in distilled water at 37°C for 24 hours, thermocycled for 1,000 cycles, and then stored for 30 days in distilled water at 37°C. Samples were then subjected to fracture in tension at a loading rate of 0.5 cm/min with the bond strengths calculated in megapascals (MPa). The fractured surfaces were examined using stereomicroscopy and scanning electron microscopy at various magnifications ranging from 5.5x to 500x to determine the type of bond failure (adhesive, cohesive, or mixed).Results Tensile bond strengths (mean ± SD MPa) were: tin-plated, 30 ± 15.7; porcelain furnace oxide, 23 ± 8.6; air-abraded, 8 ± 8.1; and finished-only, 4 ± 4.5. Statistical analysis of the tensile bond values using an ANCOVA and Tukey's multiple comparison test at a significance level of 0.05 indicated that there was no difference between the tin-plated and the furnace oxide groups, as well as between the air-abraded and the furnace oxide groups. However, there was significant difference between the tin-plated, the air-abraded, and the finished-only groups. The observed bond failures were predominantly mixed and cohesive in nature with only one adhesive failure.Conclusions There was no significant difference in the tensile bond strengths between the tin-plated group or the porcelain furnace oxide surface group. This suggests that the less-technique-sensitive porcelain furnace oxide surface treatment offers an alternative for achieving high metal-resin bonds to a high Pd?Cu alloy.
    Type of Medium: Electronic Resource
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