Electronic Resource
Woodbury, NY
:
American Institute of Physics (AIP)
Applied Physics Letters
68 (1996), S. 3251-3253
ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
Thin encapsulated silver films have been prepared on oxidized silicon by nitridation of ∼200-nm-thick Ag–19 at. % Ti alloy films and Ag(120 nm)/Ti(22 nm) at 300–700 °C in an ammonia ambient. The encapsulation process has been studied in detail by Rutherford backscattering, and scanning Auger and secondary-ion-mass spectrometry, which showed that Ti-nitride and Ti-oxide-silicide formation take place at the surface and the Ag–Ti/SiO2 interface, respectively. Four-point-probe analysis of the alloy films suggests that the resistivity is controlled by the residual Ti concentration. Resistivity values of ∼4 μΩ cm were measured in encapsulated Ag alloy films with initial low Ti concentrations. The annealed bilayer structure had minimal Ti accumulations in Ag and the resistivity values were comparable to that of the as-deposited Ag (∼3 μΩ cm). © 1996 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.116564
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