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    Electronic Resource
    Electronic Resource
    Westerville, Ohio : American Ceramics Society
    Journal of the American Ceramic Society 87 (2004), S. 0 
    ISSN: 1551-2916
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: R-curve behavior of Si3N4–BN composites and monolithic Si3N4 for comparison was investigated. Si3N4–BN composites showed a slowly rising R-curve behavior in contrast with a steep R-curve of monolithic Si3N4. BN platelets in the composites seem to decrease the crack bridging effects of rod-shaped Si3N4 grains for small cracks, but enhanced the toughness for long cracks as they increased the crack bridging scale. Therefore, fracture toughness of the composites was relatively low for the small cracks, but it increased significantly to ∼8 MPa·m1/2 when the crack grew longer than 700 μm, becoming even higher than that of the monolithic Si3N4.
    Type of Medium: Electronic Resource
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