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  • 1
    Electronic Resource
    Electronic Resource
    Failures of flip chip assemblies under thermal shock (2003)
    Bradford : Emerald
    Soldering & surface mount technology 15 (2003), S. 27-32 
    Details
    ISSN: 0954-0911
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Flip chip on board (FCOB) solder joint reliability under thermal shock stress was investigated. With underfill materials, the solder joint lifetime was increased from 37 to 1,300/2,480 cycles depending on the particular underfill material used. Through the use of CSAM, SEM, dye penetration tests and cross sectioning, the reliability of a FCOB assembly under thermal shock stress was evaluated. Both dye penetration and SEM fracture analysis can be used to measure quantitatively the extent of crack propagation for assemblies without underfill. A new failure mechanism, PCB cracking was also observed and discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/09540910310505099
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    Paper (German National Licenses)
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  • 2
    Electronic Resource
    Electronic Resource
    On the degradation of the solder joints of underfilled flip chip packages: a case study (2000)
    Bradford : Emerald
    Soldering & surface mount technology 12 (2000), S. 24-28 
    Details
    ISSN: 0954-0911
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The lifetime of flip chip solder joints can be greatly increased by applying underfill encapsulation. This paper presents a case study where the thermal cycle lifetime was increased by more than 20 times, that is from ~100 cycles to more than 2,000 cycles for a chip size of 5.6mm × 6.3mm. By combining electrical, acoustic and metallographic investigation, the degradation of the solder joints was monitored, some important factors relevant to solder joint reliability were analysed and discussed. Delamination was found not to be the dominant failure mode.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/09540910010347863
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    Paper (German National Licenses)
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  • 3
    Electronic Resource
    Electronic Resource
    Flip chip solder joint reliability under harsh environment (2003)
    Bradford : Emerald
    Soldering & surface mount technology 15 (2003), S. 15-20 
    Details
    ISSN: 0954-0911
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Flip chip solder joint reliability under thermal shock stress was investigated both experimentally and by 2D finite element simulation. The results indicate that solder fatigue is the dominant failure mode and that delamination has obvious adverse effects on the solder joint lifetime. Different material/process combinations (underfill, flux, reflow atmospheres) were designed in order to understand the role of material/process factors on the solder joint lifetime and the results are discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/09540910310505071
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    Paper (German National Licenses)
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  • 4
    Electronic Resource
    Electronic Resource
    Advances of wire chambers in Mossbauer spectroscopy
    Amsterdam : Elsevier
    Nuclear Instruments and Methods in Physics Research Section A: 252 (1986), S. 262 
    Details
    ISSN: 0168-9002
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Physics
    Type of Medium: Electronic Resource
    URL: http://linkinghub.elsevier.com/retrieve/pii/0168-9002(86)91189-7
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  • 5
    Electronic Resource
    Electronic Resource
    Identification of quasi-static displacement for constitutive models of viscoelasticity (1998)
    Springer
    Applied mathematics and mechanics 19 (1998), S. 237-242 
    Details
    ISSN: 1573-2754
    Keywords: viscoelasticity ; constitutive model ; static displacement ; inverse analysis
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Mathematics , Physics
    Notes: Abstract An explicit relation between constitutive parameters and quasi-static displacement of viscoelasticity is derived under a kind of boundary condition, and an iterative form of optimized identification is presented. Viscoelastic constitutive models are identified from a two order differential model, and effects of information errors on results of inverse analysis are discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02453388
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    Paper (German National Licenses)
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  • 6
    Electronic Resource
    Electronic Resource
    Lattice site location and electronic structure of Te in GaAs (1987)
    Springer
    Hyperfine interactions 35 (1987), S. 729-734 
    Details
    ISSN: 1572-9540
    Source: Springer Online Journal Archives 1860-2000
    Topics: Physics
    Notes: Abstract High purity 〈100〉 wafers of GaAs were implanted with radioactive129mTe and stable128Te at 110 keV to total doses of 2×1014 and 2×1015 Te/cm2 respectively and studied with RBS/ channeling and Mössbauer spectroscopy on the 27.8 keV level of129I. After implantation and/or annealing at temperatures between 200–300°C the Mössbauer spectra are dominated by a single line. Channeling reveals an appreciable residual damage in the host lattice, but also points to a substitutional position of the Te atoms. After annealing above ≌500°C, where nearly complete lattice damage recovery is obtained, the Te atoms become defect-associated. The results clearly point to the formation of TeAs−VGa complexes.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF02394486
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    Paper (German National Licenses)
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  • 7
    Electronic Resource
    Electronic Resource
    Geometric non-linear analysis of space shell structures using generalized conforming flat shell elements - for space shell structures (1998)
    Chichester : Wiley-Blackwell
    Communications in Numerical Methods in Engineering 14 (1998), S. 941-957 
    Details
    ISSN: 1069-8299
    Keywords: geometrical non-linear ; UL formulation ; drilling degrees of freedom ; generalized conforming ; arc-length method ; Engineering ; Numerical Methods and Modeling
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mathematics , Technology
    Notes: An updated Lagrangian formulation of the generalized conforming flat shell element with drilling degrees of freedom is derived based on the incremental equation of virtual work of a three-dimensional (3D) continuum for a purely geometric non-linear analysis of the space structure. While solving the non-linear equations, the Euler-Newton method and modified Euler-Newton method are used in static analyses, and the modified arc-length method and Newton arc-length method for post-buckling problems. A number of numerical examples are given to demonstrate the effectiveness of the proposed approach and programs. © 1998 John Wiley & Sons, Ltd.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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    Paper (German National Licenses)
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