ISSN:
1573-4803
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract A process has been developed for diffusion-bonding identical beryllium-copper alloy, 1.8 to 2.0 wt% Be, which has produced bond strengths comparable to that of the bulk. Bonding resulted from self-diffusion between two Be-Cu samples, brought into intimate contact and heated in a high vacuum. Metallurgical analyses of the diffusion bonds revealed the bond interface to be a continuous high-angle planar boundary. The analyses also revealed that oxides were present at the interface after bonding. The agreement between the experimental results and a theoretical model for diffusion-bonding of pure copper, derived by Hill and Wallach, was good.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF02403642
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