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  • 1
    Electronic Resource
    Electronic Resource
    A Study of the Form Error Compensation for Aspherical Lens Machining (2003)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 238-239 (Apr. 2003), p. 369-374 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/46/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.238-239.369.pdf
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    Paper (German National Licenses)
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  • 2
    Electronic Resource
    Electronic Resource
    Study on the CMP Pad Life with its Mechanical Properties (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 389-390 (Sept. 2008), p. 481-486 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The primary consumables in chemical mechanical polishing (CMP) are the polishing padand the slurry. The polishing pad significantly influences the stability of the polishing process andthe cost of consumables (CoC). During the polishing process, a diamond dresser must be frequentlyemployed to remove the debris to prevent accumulation, a process known as pad conditioning. Inthis paper, we investigated the physical properties of the CMP pad such as compressibility,thickness, and surface roughness. The difference between new and used pads has been studied.Conclusively, conditioning via a diamond dresser will extend pad life and reduce CoC
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.389-390.481.pdf
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    Paper (German National Licenses)
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  • 3
    Electronic Resource
    Electronic Resource
    Polishing Characteristics on Silicon WaferUsing Fixed Nano-Sized Abrasive Pad (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 389-390 (Sept. 2008), p. 487-492 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A mechanical polishing process was used to reduce surface roughness throughmechanical fracturing and removal of the substrate’s roughened regions. It was thus necessary tounderstand the effect of grain size and morphology on the material removal mechanisms of siliconwafers by stepwise polishing using a fixed abrasive pad. A hybrid process combining the optimizedsilicon polishing recipe for rapid roughness reduction with a micro-sized diamond, and thenpolishing using a nano-sized diamond to produce a final finished surface, may be the optimumapproach. The best result using the hybrid polishing process was the surface roughness (Ra) valueof 3.32 nm
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.389-390.487.pdf
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    Paper (German National Licenses)
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  • 4
    Electronic Resource
    Electronic Resource
    A Study on the Dressing Rate in CMP Pad Conditioning (2004)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 257-258 (Feb. 2004), p. 377-382 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/47/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.257-258.377.pdf
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    Paper (German National Licenses)
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  • 5
    Electronic Resource
    Electronic Resource
    Amorphous Diamond Dresser for CMP Fixed Abrasives Pad (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 329 (Jan. 2007), p. 157-162 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The primary consumables in chemical mechanical polishing (CMP) are the polishing padand slurry. The polishing pad significantly influences the stability of the polishing process and thecost of consumables (CoC). Usually a diamond pad conditioner is used to scrap off the polishingdebris from the pad top. Recently, an alternative planarization process can be achieved by polishingwith a "fixed abrasive pad" (FAP). In order to dress bumps on FAP, this paper use an amorphousdiamond, a diamond-like carbon deposited by cathode arc system as the dresser for FAP. Theamorphous diamond can produce a surface relief that ranges from a few nanometers to about 200nanometers. With the addition of this dressing step on a rotary platform, FAP can renew itspolishing surface 10 to 100 times before the bumps are used up. The pad cost for polishing can bereduced by at least ten folds and make FAP more desirable than slurry pad for silicon wafermanufacturer due to its intrinsic capabilities to produce flatter wafers with high polishing rate
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/52/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.329.157.pdf
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    Paper (German National Licenses)
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  • 6
    Electronic Resource
    Electronic Resource
    Study on Thin Diamond Wire Slicing with Taguchi Method (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 505-507 (Jan. 2006), p. 1219-1224 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Presently, the loose abrasive wire saw is the most commonly used technique for slicing hard and brittle materials. However its productivity is relatively low. A diamond wire saw has been developed for slicing brittle materials such as silicon wafer. The objects of this paper is to make the thin diamond wire saw apply to high cost production in semiconductor industries with the effective processing parameters such as machined surface roughness, material removal rate, the wear of thewire and the kerf width of the slicing. Effects of processing parameters on the performance of the diamond wire sawing processes are investigated by using the Taguchi method for this design of experiment (DOE). The analysis of the result shows that the optimal combinations for good surface roughness are small grain size, high wire speed, and low feed rate. Wire speed and feed rate arepositively related to material removal rate
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/12/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.505-507.1219.pdf
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    Paper (German National Licenses)
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