ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
New dielectric materials based on SiGe have been formed at room temperature by direct ion beam oxidation and nitridation. Si0.8Ge0.2 layers were deposited by molecular beam epitaxy on Si(100) and then exposed to a low-energy ion beam of 18O+2 to form oxides and 14N+2 to form nitrides. The ion energies investigated ranged from 100 eV to 1 keV. Thin films of SiGe oxide and SiGe nitride were formed at all energies used as evidenced by in situ x-ray photoelectron spectroscopy analysis. They were found to be insulating by ex situ scanning electron microscopy observations. During the ion beam processing, the Ge content of the alloy layer decreases, due to preferential sputtering of Ge and the Ge compounds. However, as the ion energy is decreased, the concentration of Ge in the alloy remains closer to the original content. The thermal stability of these new SiGe dielectrics was also assessed up to 500 °C.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.106122
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