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  • 1
    Electronic Resource
    Electronic Resource
    Development of brain-derived neurotrophic factor and neurotrophin-3 immunoreactivity in the lower auditory brainstem of the postnatal gerbil (2001)
    Oxford, UK : Blackwell Science Ltd
    European journal of neuroscience 14 (2001), S. 0 
    Details
    ISSN: 1460-9568
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Medicine
    Notes: The localization of brain-derived neurotrophic factor (BDNF) and neurotrophin-3 (NT-3) in the gerbil auditory brainstem was studied during normal postnatal development. The principal objective of this paper was to compare the developmental distribution of BDNF and NT-3 proteins to the known developmental distribution of their cognate, high-affinity tyrosine kinase receptors. BDNF and NT-3 proteins were localized using standard immunohistochemistry. No specific immunoreactivity for BDNF or NT-3 was detected on the day of birth (P0) in any auditory structure, although fibers comprising the spinal tract of the Vth cranial nerve were well labelled with antibodies against BDNF. Diffuse immunoreactivity for both BDNF and NT-3 was first detected at P3 in the cochlear nucleus and in several second order auditory nuclei in the superior olivary complex. This diffuse immunoreactivity became clustered and restricted to neuronal cell bodies by P10. Immunoreactivity for both BDNF and NT-3 transiently disappeared in the lateral and medial superior olivary nuclei at P10. However, neurons in the medial nucleus of the trapezoid body remained immunopositive for both BDNF and NT-3. Fibers in the trapezoid body were labelled with BDNF immunoreactivity by P12. Between P12 and P15, the distribution of BDNF and NT-3 immunoreactivity in the cochlear nucleus and superior olivary complex became comparable to adult (P140) immunolabel. These results show that the normal developmental distribution of the neurotrophins BDNF and NT-3 in the lower auditory brainstem occurs during the first two postnatal weeks in parallel with the developmental expression of their cognate receptors, trkB and trkC.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1046/j.0953-816x.2001.01690.x
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  • 2
    Electronic Resource
    Electronic Resource
    Failures of flip chip assemblies under thermal shock (2003)
    Bradford : Emerald
    Soldering & surface mount technology 15 (2003), S. 27-32 
    Details
    ISSN: 0954-0911
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Flip chip on board (FCOB) solder joint reliability under thermal shock stress was investigated. With underfill materials, the solder joint lifetime was increased from 37 to 1,300/2,480 cycles depending on the particular underfill material used. Through the use of CSAM, SEM, dye penetration tests and cross sectioning, the reliability of a FCOB assembly under thermal shock stress was evaluated. Both dye penetration and SEM fracture analysis can be used to measure quantitatively the extent of crack propagation for assemblies without underfill. A new failure mechanism, PCB cracking was also observed and discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/09540910310505099
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  • 3
    Electronic Resource
    Electronic Resource
    Flip chip solder joint reliability under harsh environment (2003)
    Bradford : Emerald
    Soldering & surface mount technology 15 (2003), S. 15-20 
    Details
    ISSN: 0954-0911
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Flip chip solder joint reliability under thermal shock stress was investigated both experimentally and by 2D finite element simulation. The results indicate that solder fatigue is the dominant failure mode and that delamination has obvious adverse effects on the solder joint lifetime. Different material/process combinations (underfill, flux, reflow atmospheres) were designed in order to understand the role of material/process factors on the solder joint lifetime and the results are discussed.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1108/09540910310505071
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  • 4
    Electronic Resource
    Electronic Resource
    Study of Fe-Ni(Cr) Alloy and Nano-Al〈sub〉2〈/sub〉O〈sub〉3〈/sub〉 Particles Composite Coating Prepared by Laser Cladding (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 118 (Dec. 2006), p. 585-590 
    Details
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Notes: The experiments of laser cladding Ni-coated nano-Al2O3 powder were made on 2Cr13stainless steel using 7kW CO2 laser processing system. The microstructure and mechanicalcharacteristics of composite coating were tested by scanning electronic microscope (SEM), X-raydiffraction (XRD), energy dispersion analyzer of X-ray (EDAX) and microhardness tester. Theresults showed that the composite coating was composed of superfine cellular dendritic structure.The X-ray diffraction data revealed that the cellular grains were composed of nano-Al2O3 particles,iron nickel alloy and iron chromium alloy. The mechanical characteristics of composite coatinggreatly increased. Compared with parent metal, the average hardness of composite coatingincreased by 1 time, and its wear property increased by 1.25 times
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/23/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.118.585.pdf
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