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  • 1
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Applications of Surface Science 20 (1984), S. 132-144 
    ISSN: 0378-5963
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Physics
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 64 (1988), S. 2973-2980 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The diffusion of several elements implanted into layers of CoSi2 with a nominal thickness of 800 nm, grown by metal-silicon reaction, has been studied by secondary ion mass spectroscopy. Boron has by far the highest mobility. It is totally homogenized by heat treatment for 0.5 h at 800 °C; it displays evidence of grain-boundary diffusion at 400 °C and of lattice diffusion at 450 °C. The next group of elements, gallium, phosphorus, and germanium (used as a tracer in lieu of a silicon isotope) diffuse distinctly less rapidly, and remain nonhomogenized after annealing at 800 °C. The lattice diffusion of arsenic and antimony is not detectable (by the means presently used), even after heat treatment at the same relatively high temperature. Low-temperature effects, and effects far away from the implanted region, are dominated by grain-boundary diffusion. The lattice diffusion increases from boron to phosphorus and germanium, with activation energies determined to be 2.0 and 2.7 eV for boron and phosphorus, respectively. The results are discussed by comparison with those previously obtained with TiSi2.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 90 (2001), S. 6409-6415 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The formation of C54 TiSi2 using Ti–Nb alloys deposited on polycrystalline Si substrates was studied by means of in situ x-ray diffraction and resistance measurements during temperature ramping. Alloys with Nb contents ranging from 0 to 13.6 at. % were used. The formation temperature of C54 TiSi2 was reduced in the presence of Nb. However, the addition of Nb in Ti did not cause fundamental changes in the evolution of resistance versus temperature. This latter observation suggests that the mechanism for the formation of C54 TiSi2 remained the same in spite of the enhancement effect. For alloys with up to 8 at. % of Nb, the C49 TiSi2 phase formed first, as with pure Ti. When annealing the alloy with 13.6 at. % Nb, neither C49 TiSi2 nor C54 were found in the usual temperature ranges, instead, C40 (Nb,Ti)Si2 was observed. This phase transformed to C54 (Nb,Ti)Si2 above 950 °C. The apparent activation energy associated with the formation of C54 TiSi2 was obtained by annealing the samples at four different ramp rates from 3 to 27 K/s; it decreased continuously from 3.8 to 2.5 eV with increasing Nb content from 0 to 8 at. %. The apparent activation energy for the formation of C40 (Nb,Ti)Si2 was found to be 2.6 eV. The possible physical meaning, or lack thereof, of the high activation energies derived from experimental measurements is extensively discussed. A qualitative model is proposed whereby nucleation would be rate controlling in pure TiSi2, and interface motion in samples with 8 at. % Nb. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 79 (1996), S. 4078-4086 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The solid state reaction between a Ni (7 at. % Au) film and a Si substrate at temperatures ranging from 250 to 800 °C is examined by scanning electron microscopy, x-ray diffraction, and Rutherford backscattering spectrometry. Compared to the usual features for thin film reaction of Ni with Si, we observed the following. (i) The simultaneous growth of Ni2Si and NiSi, and the growth of NiSi at the expense of both Ni2Si and Ni. This is related to Au accumulation in the metal layer. (ii) Au precipitation at 300 °C followed by the dissolution of the clusters thus created above the Au–Si eutectic temperature (370 °C). (iii) A decrease of the temperature of formation of NiSi2 and the appearance of thickness oscillations that are characteristic of nucleation. These different effects are interpreted by taking into account the metallurgy of the system: segregation of Au in the Ni film, Au solubility in the different silicides, change in surface and interface energies, and chemical interactions with Si. © 1996 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 77 (1995), S. 934-936 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The injection of point defects into the silicon substrate consecutive to a solid state reaction between nickel and silicon was studied by transmission electron microscopy. By observation and determination of the density and size of interstitial type dislocation loops in the substrate at the different steps of the reaction, we could estimate that one interstitial is injected per 5000 nickel atoms. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 78 (1995), S. 1638-1642 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The solid-state reaction between a nickel (7 at. % gold) film and a silicon substrate at temperature lower than the gold-silicon eutectic temperature (370 °C) is examined by transmission and scanning electron microscopy and by Rutherford backscattering spectrometry. Epitaxial NiSi and preferentially oriented Ni2Si are present and gold precipitation occurs at the inner interface. This gold precipitation leads to a peculiar backscattering spectrum which is analyzed taking into account morphological information. The driving forces leading to gold redistribution are interpreted in terms of surface energies and chemical interactions with silicon. © 1995 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 76 (1994), S. 5195-5201 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Thin-film reactions between nickel and silicon are investigated by differential scanning calorimetry and transmission electron microscopy on evaporated bilayers with different compositions and thicknesses. The thermograms are interpreted by a computer modeling, based on diffusion-controlled growth. Experiments and simulation reveal the simultaneous formation of crystalline Ni2Si and of an amorphous phase of composition probably near NiSi. The derived kinetic data confirm literature values from isothermal experiments.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 67 (1990), S. 3315-3322 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The Ni2Si lattice and grain boundary self-diffusion parameters have been studied using radiotracers 63Ni for Ni diffusion, 68Ge for Si diffusion, conventional sectioning techniques, and bulk specimens. The results obtained show that Ni diffuses faster than Ge(Si) in the lattice (and in the grain boundaries) of Ni2Si, in agreement with the structure of this silicide. The activation energies for Ni lattice and grain boundary diffusion are respectively 2.48 eV (measured between 650 and 910 °C) and 1.71 eV (530–710 °C). These values are comparable to those obtained in pure metals of similar melting temperature. They suggest that Ni diffuses on its own sublattice by a vacancy mechanism. Grain boundary diffusion in this intermetallic compound appears as a very efficient process for mass transport at low temperature. A quantitative comparison with the kinetic of formation of Ni2Si (by solid state reaction between a Ni film and a Si substrate) indicates that the growth of thin films is controlled by the diffusion of Ni along the silicide grain boundaries. This mechanism explains the rapidity of the formation and its low activation energy (≈1.6 eV).
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 59 (1986), S. 3458-3466 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The formation of Ni3Si2 from the reaction of Ni2Si with NiSi, and that of Pt6Si5 from the reaction of Pt2Si with PtSi have been investigated by Rutherford backscattering, x-ray diffraction, resistance measurements, and optical and electronic microscopy. Standard x-ray diffraction patterns were calculated for Pt6Si5 and for the high-temperature form (hexagonal) of Pt2Si. These are shown to match experimental diffraction patterns. Both Ni3Si2 and Pt6Si5 form quite suddenly (at 470 and 535 °C, respectively) according to the pattern of nucleation-controlled reactions which are anticipated when the free energies of formation of the new phases are sufficiently small. These observations are discussed with respect to the absence of both Ni3Si2 and Pt6Si5 from the sequence of phases which form when Ni and Pt thin films react with Si. Resistivity measurements are reported for Ni3Si2, Pt6Si5, and for the two forms (low and high temperature) of Pt2Si.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 63 (1988), S. 5335-5345 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Gallium, Sb, and Ge were implanted into thick (about 400 nm) layers of TiSi2 prepared by metal-silicon reaction. The diffusion of the implanted atoms was analyzed by means of secondary ion mass spectrometry. Gallium was introduced because a former study had shown that the usual p-type dopant B does not diffuse in TiSi2. Germanium was used in lieu of a Si tracer. Its diffusion characteristics are compared to those of P and As (as well as Si) which had been investigated previously. Germanium and Ga diffuse readily above 600 °C, but Sb does not. Its diffusion appears to be limited to grain-boundary effects. Accumulations of the diffusing atoms are observed (except for Sb) at the silicide-silicon interface. These are due to kinetic effects, namely fast diffusion at grain boundaries and interfaces, rather than to real adsorption which is an equilibrium condition. Because diffusion in intermetallic compounds has been shown to be significantly affected by variations in stoichiometry, experiments were conducted with films implanted not only with foreign atoms but with Ti as well. These did not lead to significantly different observations.
    Type of Medium: Electronic Resource
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