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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Review of Scientific Instruments 59 (1988), S. 1485-1487 
    ISSN: 1089-7623
    Source: AIP Digital Archive
    Topics: Physics , Electrical Engineering, Measurement and Control Technology
    Notes: We have measured time-resolved visible spectra emitted from a plasma formed when the output from a dye laser irradiates solid lithium. Such a plasma has potential as a source of lithium ions for ion-driven inertial confinement fusion, and it also provides a useful source for developing diagnostics. The laser delivered 0.5 J onto a 2–7-mm-diam spot, with a 900-ns pulse length. Experiments were performed with the wavelength tuned to the Li i 2s–2p resonance line at 6708 A(ring) and off resonance at 6728 A(ring). The target was a 500–1000-A(ring)-thick Li film, vacuum evaporated in situ onto a substrate. The light from the plasma was coupled into the entrance slit of a 1-m Czerny–Turner spectrograph, and the output from the spectrograph was focused onto the input slit of a streak camera. The electron density was obtained from Stark-broadened widths of Li i 2p–4d, 2p–5d, and 2p–4s, and H i 2p–4d. An irradiance of 2×106 W/cm2 at 6708 A(ring) resulted in a peak electron density of 3.9×1017 cm−3. The density decreased at lower irradiance, with an intensity threshold of 5×105 W/cm2 for producing an ionized plasma. The threshold for producing a plasma was higher with the laser tuned off resonance, although high-density lithium plasmas could still be formed at relatively low laser irradiance.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Review of Scientific Instruments 70 (1999), S. 468-470 
    ISSN: 1089-7623
    Source: AIP Digital Archive
    Topics: Physics , Electrical Engineering, Measurement and Control Technology
    Notes: We have developed a comprehensive diagnostic package for observing z-pinch radiation along the pinch axis on the Z accelerator. The instrumentation, fielded on the axial package, are x-ray diagnostics requiring direct lines of sight to the target. The diagnostics require vacuum access to the center of the accelerator. The environment is a hostile one, where we must deal with an intense, energetic photon flux (〉100 keV) debris (e.g., bullets or shrapnel), and mechanical shock in order for the diagnostics to survive. In addition, practical constraints require the package be refurbished and utilized on a once a day shot schedule. In spite of this harsh environment, we have successfully fielded the diagnostic package with a high survivability of the data and the instruments. In this article, we describe the environment and issues related to the reentrant diagnostic package's implementation and maintenance. © 1999 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 3
    ISSN: 1089-7623
    Source: AIP Digital Archive
    Topics: Physics , Electrical Engineering, Measurement and Control Technology
    Notes: We assembled and tested a visible framing camera system to take 5 ns FWHM images of the early time emission from a z-pinch plasma. This diagnostic was used in conjunction with a visible streak camera allowing early time emissions measurements to diagnose current initiation. Individual frames from gated image intensifiers were proximity coupled to charge injection device cameras and read out at video rate and 8-bit resolution. A mirror was used to view the pinch from a 90° angle. We observed the destruction of the mirror surface, due to the high surface heating, and the subsequent reduction in signal reflected from the mirror. Images were obtained that showed early time ejecta and a non-uniform emission from the target. This initial test of the equipment highlighted problems with this measurement. We observed nonuniformities in early time emission. This is believed to be due to either spatially varying current density or heating of the foam. Images were obtained that showed early time ejecta from the target. The results and suggestions for improvement are discussed in the text. © 1997 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Review of Scientific Instruments 67 (1996), S. 512-521 
    ISSN: 1089-7623
    Source: AIP Digital Archive
    Topics: Physics , Electrical Engineering, Measurement and Control Technology
    Notes: A specially designed ultrahigh vacuum in situ surface analysis and wetting system has been constructed to study the spreading of liquid metal solders on carefully prepared and well-characterized solid substrates. The system consists of a standard ultrahigh vacuum surface analysis chamber linked to a reaction chamber for wetting or other experiments at pressures up to atmospheric. A sophisticated video system allows real-time monitoring of the spreading of the liquid metal through both side and top views. An infrared imaging system allows accurate remote temperature measurements. Sample surfaces are prepared and spreading experiments performed without intermediate exposure of the surfaces to the contaminating atmospheres. Solder spreading is performed under 50 Torr of highly purified helium gas to allow for adequate thermal coupling between the solder and the substrate. Initial studies have been completed for the spreading of pure tin solder on copper substrates in the absence of any fluxing agent. Three types of copper substrate surfaces were investigated in these experiments: the sputter-cleaned, air-exposed, and the as-received surface. Surface chemical analysis by x-ray photoelectron spectroscopy showed the air-exposed surface to consist of about 3 nm of Cu2O, while the as-received surface consisted of about 8 nm of Cu2O. The sputter-cleaned surface contained less than one monolayer (0.3 nm) of Cu2O. Spreading experiments utilizing a linear temperature ramp show that pure tin solder spreads readily on oxidized copper surfaces at elevated temperatures. The initiation temperature for rapid tin spreading on the as-received copper surface was 325 °C. Decreasing the thickness of the oxide on the surface lowered the observed temperature for the initiation of spreading and increased the rate of spreading. On the sputter-cleaned copper surface, rapid solder spreading was observed immediately upon melting of the solder.
    Type of Medium: Electronic Resource
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