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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 67-68 (Apr. 1999), p. 149-154 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 67-68 (Apr. 1999), p. 269-276 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 37-38 (Mar. 1994), p. 323-328 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Woodbury, NY : American Institute of Physics (AIP)
    Applied Physics Letters 55 (1989), S. 1780-1782 
    ISSN: 1077-3118
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Amorphous silicon films, doped with antimony at a relative high concentration of ∼(4–5)×1020 cm−3, were deposited by means of a molecular beam on (100) Si substrates. These films were subsequently heat treated at temperatures between 500 and 700 °C for times between 5 s and 12 h. It was found that at 500 °C the resistivity decreased with time during solid phase epitaxial growth of the amorphous films and induced electrical activation of Sb "quenched-in'' the Si. At the higher temperatures, however, after an initial decrease to a minimum value the resistivity increased with the heat treatment time as a result of a precipitation of Sb from the supersaturated crystallized Si films. The times to obtain the minimum values of the resistivity are consistent with the rates of the solid phase epitaxial growth of amorphous Si films on (100) Si given in the literature for the various temperatures.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 66 (1989), S. 5890-5893 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of Ar ion implantation energy to amorphize the (100)Si substrate and heat treatments on the I-V characteristics was studied. It was found that the electrical resistance of the contacts increased as a result of increasing the ion implantation energy, the heat treatment temperature, and time. The I-V characteristics of the contacts are analyzed with a model of electrical conductivity in amorphous solids. Based on this model and the experimental results, the distance between two adjacent ionized defects that are active in the electrical conductivity, was calculated. The effect of ion implantation energy and the heat treatments on the I-V characteristics are correlated to the microstructural and compositional alterations in the amorphous Si region of the contacts.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 72 (1992), S. 5153-5157 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The incubation time for the crystallization of amorphous Ge (a-Ge) films was studied as a function of temperature between 150 and 500 °C by means of both in situ transmission electron microscopy and Raman scattering spectroscopy. The temperature dependence of the incubation time for free-sustained a-Ge films follows an Arrhenius curve with an overall (nucleation+growth) crystallization process activation energy of 2.0 eV. In the case where the a-Ge films were on Si3N4 substrates, an earlier stage of the crystallization was observed (nucleation), having an activation energy of 1.3 eV. In addition, it was found that a thin metallic layer of Al or Au, deposited on the a-Ge films, induces a very fast crystallization in the mode of dendritic growth, as reflected by a low activation energy (0.9 eV) for the incubation time temperature dependence.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 67 (1990), S. 3003-3010 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The microstructure and electrical properties of the contacts formed in the Ti(30 nm)/Al(10 nm)/〈100〉p-type Si system due to rapid thermal processing at temperatures between 300 and 800 °C were studied extensively. An eutectic melting, initiated at the Al/Si interface, was already observed after 2 s at 580 °C. This rapid melting, which was first observed by the authors in the Ni/Al/Si system, resulted in the formation of a Al3 Ti(20 nm)/Ti7Al5Si12 (5 nm), epi-TiSi2 (45 nm)/p-type Si layered structure with smooth interfaces. The TiSi2 layer grew epitaxially on the 〈100〉Si substrate with the following relationships: (101)TiSi2 (C54)(parallel)(001)Si and [151]TiSi2 (C54)(parallel)[220]Si. The melting reaction influenced the sheet resistance and the Schottky barrier height of the formed contacts, which decreased from 0.67 to 0.49 eV at 580 °C. The correlation between the electrical properties and the microstructure of the contacts formed in the Ti/Al/Si system due to the rapid thermal processing is discussed in comparison with the Ni/Al/Si system.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 67 (1990), S. 3025-3031 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of rapid thermal annealing on the composition, structure, and I-V characteristics of Al(0.8% Si)/Ti:W/a-Si contacts was studied. It was established that heat treatments in temperatures ranging between 300 and 500 °C for a time span of 10 s led to grain boundary diffusion of Si and Al through the Ti10W90 layer. Subsequently, Si diffused into the Al film while Al penetrated into the amorphous Si. No silicides or intermetallic compounds were observed to form as a result of the rapid heat treatments. The electrical measurements showed that the I-V curve in the forward bias is identical to that of the reversed bias. The electrical resistance of the contacts increased as a result of a rise in the heat treatment temperature. A model of electrical conductivity in amorphous semiconductors was applied to explain the electrical behavior of the contacts.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 4341-4343 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The effect of heat treatments on the structure and composition of a system consisting of a conductive outer layer made of Al(0.8% Si) thin film, TiW(30:70 at. %) thin film as a diffusion barrier, and a polycrystalline Si substrate was studied. It was established that heat treatments at temperatures ranging between 400 and 500 °C led to the diffusion of Si and Al through the TiW layer, following which Al diffused into the polycrystalline Si, while Si diffused into the Al film. The silicides of TiSi, TiSi2, and intermetallic compounds of Al3Ti and WAl12 were formed at the Al/TiW interface as a result of the 30-min heat treatment at temperatures ranging between 450 and 500 °C.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 84 (1998), S. 4343-4350 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Transport properties of crystallized amorphous Si1−xGex films, having different Ge content (x) and highly doped with boron were studied. The films were deposited by molecular beam at room temperature and subsequently annealed in vacuum at different temperatures between 500 and 900 °C for 1 h. The microstructure of the crystallized Si1−xGex films was characterized by means of transmission electron microscopy, x-ray diffraction, and scanning electron microscopy. Measured transport properties included Hall hole concentration (pH), Hall mobility (μH), electrical conductivity (σ), and the Seebeck coefficient (S), from which the "power factor" (S2σ) was evaluated. The results obtained for the Hall mobility of the Si1−xGex films are discussed on the basis of the carrier trapping model. The trapping state density at the grain boundaries increases with increasing B concentration, although it is not significantly dependent on Ge content. Consequently, the mobility energy barrier decreases with increasing B concentration and increasing Ge content. It was found that in all the studied Si1−xGex films, independent of x, the predominant scattering mechanism changes from acoustic phonon scattering to ionized impurity scattering with increasing the boron concentration from 5×1018 to 5×1020 cm−3. In addition, the Si1−xGex films demonstrate high electrical conductivity as well as a high Seebeck coefficient, after 1 h annealing at 600–800 °C, and thus exhibit a high "power factor" of the order of 6 μW/cm K2. Thus, these films have potential applications in thin-film thermoelectric devices. © 1998 American Institute of Physics.
    Type of Medium: Electronic Resource
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