ISSN:
1662-8985
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The effect of surface states of substrate and additives on copper electrodeposition for thinfilm applications was investigated. Titanium substrate states were mechanically and chemicallymoderated and several additives such as Arabic gum, hydroxyl ethyl cellulose, and chlorine were usedduring electrodeposition process under a constant current condition with current density of 500mA/cm2. Results obtained using SEM, X-ray, and AFM for early stage of copper nucleation andgrowth revealed that substrate conditions and additives appear to be effective in producinguniformly-distributed copper nuclei and their subsequent growth in a regulated manner of surfaceleveling. The shape of copper nuclei was clearly affected by the surface state of the substrate. It seemsto be related with dislocations produced on the titanium cathode during surface moderating. Hardness,growth direction, and resistivity of copper deposits changed with the kind of additives
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/40/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.29-30.59.pdf
Permalink