ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The passivation cracking of Micro-structures of IC packages is studied by maximumprincipal stress theory using a certain 2D FEM model with different design parameters, pitch of lines,width of line, thickness of epoxy, thickness of dielectric layer, thickness of glue, the glue material’syielding stress and Aluminium yielding stress (following as “d”, “w”, “t_epo”, “t_Teos”, “t_glue”“sy_glue” and “sy_al” respectively). For different critical process steps, the final process temperatureis acted as a representative parameter to analyze its impact. Furthermore, Response Surface Model(RSM) of principal stress is established using any two design parameters. Results show that “d”, “w”,“t_epo”, “sy_glue” and “sy_al” will have great influence on passivation cracking while “t_Teos” havea little impact
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/52/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.324-325.515.pdf
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