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  • 1
    Electronic Resource
    Electronic Resource
    Survey on the Design and Planning of Cable Harness Assemblies in Electromechanical Products (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Applied mechanics and materials Vol. 10-12 (Dec. 2007), p. 889-893 
    Details
    ISSN: 1662-7482
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Cable harnesses are essential assembly components that provide the electricalinterconnectivity between different modules within a electromechanical product. The design andplanning of cable harness assembly is a very complicated, time-consuming and key problem.Currently the design and manufacture of cable harness assembly have remained a labor intensiveprocess. In this paper firstly the published academic in the design and planning of cable harness isreviewed. Then on the basis of analysis, its development orientations are proposed including CADtechnologies, artificial intelligence, virtual reality and three-dimensional visual assembly
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/38/transtech_doi~10.4028%252Fwww.scientific.net%252FAMM.10-12.889.pdf
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  • 2
    Electronic Resource
    Electronic Resource
    A New Method with Supersonic Focalize Decomposition and Chemical Flocculate Floating-Air to Process the Dyeing and Printing Wastewater (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Applied mechanics and materials Vol. 10-12 (Dec. 2007), p. 588-593 
    Details
    ISSN: 1662-7482
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: According to dyeing and printing wastewater of high chroma and difficultdecomposition, a new ultrasonic focalize decomposition method is provide, which can decomposethose are difficult to do. In this article, Dynamic adding-pressure dissolving-air, ultrasonic focalizeand flocculate floating-air are assembled to advance the treatment effect. Through the research, thedynamic models of adding pressure and dissolving air and flocculate floating-air are constructed.Based on the theory research, a experiment device is designed. The effect and influence factors arediscussed, which provides a new way to process dyeing and printing wastewater of high chroma anddifficult decomposition
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/38/transtech_doi~10.4028%252Fwww.scientific.net%252FAMM.10-12.588.pdf
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  • 3
    Electronic Resource
    Electronic Resource
    Study on Substrate Temperature Field during its Swing Movement in Miniature HFCVD System (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Applied mechanics and materials Vol. 10-12 (Dec. 2007), p. 599-604 
    Details
    ISSN: 1662-7482
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Based on the traditional HFCVD system, a new set of miniature HFCVD diamondfilm-deposition system with a swingabe substrate platform has been designed. Simulations of thesubstrate temperature field have been done respectively when the platform is still, rotatingcontinuously, or swinging. The results suggest that when the swing angle is bigger than 100,uniform temperature field close to that achieved through continuous rotation can be got. So, in thispaper, the crank-rocker mechanism has been used to produce a swingable substrate platform, whichsimplifies the traditional structure. And satisfactory temperature field can be achieved. It meets therequirements of the miniaturization design
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/38/transtech_doi~10.4028%252Fwww.scientific.net%252FAMM.10-12.599.pdf
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  • 4
    Electronic Resource
    Electronic Resource
    Investigation on the Machining of Thick Diamond Films by EDM Together with Mechanical Polishing (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 24-25 (Sept. 2007), p. 377-382 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Although research on various diamond polishing techniques has been carried for years,some issues still need to be examined in order to facilitate application on large areas in acost-efficient manner. A compositive technique for machining efficiently thick diamond filmsprepared by DC plasma arc jet is reported in the present paper. A two-stage polishing was applied onthick polycrystalline diamond films, by employing first electro-discharge machining (EDM) forrough polishing and subsequently mechanical polishing for finishing operations. Experimentalresults obtained clearly indicate the applicability of the proposed two-stage technique for fabricatingtransparent diamond films that can be used for the production of X-ray windows. Appropriate etchingwith EDM is an effective pretreatment method for enhancing the efficiency of rough polishingprocess in mechanical polishing of thick diamond film. The machined surfaces of diamond films arestudied by Scanning Electron Microscope (SEM) and Raman Scattering Spectroscopy (Raman)
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/39/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.24-25.377.pdf
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  • 5
    Electronic Resource
    Electronic Resource
    Effect of Ice Counterparts on the Friction Behavior of Single Crystal Silicon Wafer (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 167-172 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The friction behavior of single silicon wafer sliding against different ice counterparts(α-Al2O3, CeO2 and SiO2) at 10±0.5 °C within a velocity of 60 rpm~300 rpm were studied using ahome-made friction and wear testing machine. The morphologies and surfaces roughness of the wornsilicon wafers were observed and examined on a non-contact surface topography instrument (ADE). Itwas found that the friction coefficient of the single silicon wafer decreased with the increase of slidingvelocity. Single crystal silicon wafer coupled with α-Al2O3 ice counterpart recorded the highestfriction coefficient and the biggest surface roughness, while it had the lowest friction coefficient andthe smallest surface roughness as with CeO2 ice counterpart. One reason was that a series oftribochemical reactions occurred at the local contact point between the ice counterpart and the siliconwafer during sliding. Under alkaline condition, there would be a soft corrosion layer formed on thesurface of the silicon wafer. Another reason was that the hardness of the abrasive particles wasdifferent and this caused different cutting depth of them
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.53-54.167.pdf
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  • 6
    Electronic Resource
    Electronic Resource
    Study on Variable Spot Cladding for Large Area Laser Surface Modification (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 319-324 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: In modern surface modification manufacturing technology, laser cladding is a high-techwhich has good prospects for development. However, for the large area laser cladding surfacemodification, there has the contradiction between cladding efficiency and cladding accuracy of thecladding. If using the smaller spot, it will be inefficient, if the spot increasing, the accuracy ofmarginal part of the cladding will be poor, the "stage effect" will be obvious. The variable spotpowder feeder is designed, and the variable spot cladding process with small facula outlining borderand big facula filling in central section is introduced, which resolves the contradiction between thetwo effectively. Experimental proves that surface quality with variable spot cladding is better. In theoverlap area, due to the second lixiviation caused by repeated heating, the microhardness value ofmulti-track overlap cladding is higher than the structure in the non-overlap area
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/41/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.53-54.319.pdf
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  • 7
    Electronic Resource
    Electronic Resource
    Experimental Study on Cryogenic Polishing Single Silicon Wafer with Nano-Sized Cerium Dioxide Powders (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 24-25 (Sept. 2007), p. 177-182 
    Details
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Cryogenic polishing single silicon wafer with nano-sized CeO2 abrasives can be known ascryogenic fixed abrasives CMP (CFA-CMP). The abrasive slurry was made of nano-sized CeO2particles dispersed in de-ionized water with a surfactant and the polishing slurry froze to formcryogenic polishing pad. Then the polishing tests of the blanket silicon wafers in the presence of thecryogenic polishing pad containing the nano-particulates were carried out. The morphologies andsurfaces roughness of the polished silicon wafers were observed and examined on an atomic forcemicroscope (AFM). The results show that a super smooth surface with roughness of 0. 293 nm isobtained within 5000 nm× 5000 nm and the removal of material is dominated by plastic flowage
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/39/transtech_doi~10.4028%252Fwww.scientific.net%252FAMR.24-25.177.pdf
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  • 8
    Electronic Resource
    Electronic Resource
    Effects of CH〈sub〉4〈/sub〉 Concentration on CVD Diamond Coatings Deposited on Cemented Carbide Cutting Cools (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 480-483 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Chemical vapor deposition (CVD) diamond coatings were deposited on cemented carbidecutting cools by an electron-assisted hot filament chemical vapor deposition (EACVD) equipmentdeveloped by the authors. The CVD diamond coatings were studied by Scanning ElectronMicroscope (SEM) and Raman Scattering Spectroscopy (Raman). The experimental results show thatCH4 concentration in the source gas performs great influence on the micro-structure, surfaceroughness, composition, residual stress and adhesion of the CVD diamond coatings. The increase ofCH4 concentration results the change of diamond crystal from {111} orientation to {100} orientation,the decrease of the surface roughness and the increase of sp2 carbon in the CVD diamond coatings. Aresidual compressive stress exists in the CVD diamond coatings. The residual stress decreases withincreasing CH4 concentration. A higher or lower CH4 concentration tends to reduce adhesion stress ofthe continuous CVD diamond coatings
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.480.pdf
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  • 9
    Electronic Resource
    Electronic Resource
    Green, Flexible, Intelligent: Clamping System Based on Thermal Sensitive Material with Volume Effect (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 1028-1031 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Nowadays, the research on the greenization of clamping technology obviously lags theresearch of green cutting, green machine tool etc. This paper provides a new clamping system toclamp the workpiece by the green fast heating/cooling adverse-change semiconductor technologyand temperature controllability to thermal sensitive medium with volume effect. This clampingsystem has a low speed operating part, few moving parts, low medium leakage and noise pollutionand it is convenient to be flexible configuration of multi-place, multi-workpiece and multi-directionclamping. Furthermore, the clamping system can use the sensors of temperature, pressure anddisplacement to collect the relative data and process them by computer, then intelligently control theclamp force and clamping displacement
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.1028.pdf
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  • 10
    Electronic Resource
    Electronic Resource
    Investigation of Technology and Analysis of Residual Stress in Large Area Diamond Films (2006)
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 464-467 
    Details
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: We investigated the residual stress in diamond films grown on molybdenum substrates asa function of different places in the same large sample. The diamond film wafers of Ф60 mmdiameter were deposited at 900℃ by high power DC arc plasma jet CVD method using a gasmixture of methane (1.8% vol.) and hydrogen ( 90% vol.). The grain sizes, obtained from the topview scanning electron microscopy (SEM) images, were found to become larger from center to theborder in the same sample, and the x-ray diffraction indicated that the intensity of characteristicspectroscopy in same diamond film was changed from (220) to (111) with the increases of (311).Profile curves presented the appreciable difference of surface texture from center to edge. The filmhad 4.3GPa of residual compressive stress. Examination of the Raman spectra of the film revealedthat residual stress in the film of up to approximately 0.70GPa, and the Raman spectroscopy shiftsfrom 1332.99cm-1 at the center to 1331.17cm-1 at the border, which means the stress mode changedfrom compressive to tensile. These demonstrated a significant inhomogeneity of stress in diamondfilms. The differences have been attributed partly to high temperature inhomogeneity arc jet duringgrowth and morphological aspects of the film growth. The relationships between stress and methaneconcentration, and substrate temperature are discussed in detail
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/02/14/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.464.pdf
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