ISSN:
1434-601X
Source:
Springer Online Journal Archives 1860-2000
Topics:
Physics
Notes:
Abstract The isochronal and isothermal recovery of the electrical resistivity after large homogeneous compression of copper and silver was measured with a low frequency eddy current method. Two relations between the recovery data and the flow stress were found: 1. For high purity copper and silver the recovery of the electrical resistivity with recrystallization is proportional to the square of the flow stress. 2. The temperature at which half of the resistivity decrease with recrystallization is reached may be related to the flow stressσ by the equation $$\sigma ^2 e^{ - a/T_R } = const$$ . The present experiments indicate that a simple relation between the quantitya and the activation energy for recrystallization cannot be given.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF01392236
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