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  • 1985-1989  (2)
  • 1965-1969
  • 1987  (2)
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  • 1985-1989  (2)
  • 1965-1969
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  • 1
    Electronic Resource
    Electronic Resource
    Oxford, UK : Blackwell Publishing Ltd
    Fatigue & fracture of engineering materials & structures 9 (1987), S. 0 
    ISSN: 1460-2695
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Life prediction for creep-fatigue loading conditions should be related to creep damage mechanisms. In order to examine the effect of the creep damage mode on rupture life under creep-fatigue loading, a “combined creep-fatigue loading test” was carried out on 316 stainless steel. In this method, creep loading and fatigue loading are repeated alternately. The fracture criteria under combined loading closely depend on the creep fracture modes of the static creep test. A new life prediction method which uses this new fracture criterion is proposed. The criteria are changed when the creep damage mode varies. In order to verify the adequacy of this method, fatigue tests with a tensile strain-hold wave form were carried out. It is clear that rupture life in such fatigue tests is dependent on the chosen fracture criteria.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Copenhagen : International Union of Crystallography (IUCr)
    Applied crystallography online 20 (1987), S. 147-160 
    ISSN: 1600-5767
    Source: Crystallography Journals Online : IUCR Backfile Archive 1948-2001
    Topics: Geosciences , Physics
    Notes: Reflection electron microscopy (REM) in ultra-high vacuum (UHV) conditions is reviewed. UHV-REM can characterize surface structures of monolayer levels such as steps, domains of reconstructed surface structures and their boundaries and these capabilities are used to observe surface dynamic processes such as phase transitions of reconstructed surface structures and adsorbate structures and adsorption processes, oxidations, sublimations and ion-sputtering and annealing. The method is compared with other surface-imaging techniques.
    Type of Medium: Electronic Resource
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