ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
Detection and gettering of Co contamination in processed Si is an important issue in integrated circuit fabrication. In this work, Co was intentionally introduced into Si by ion implantation, and its diffusion monitored by secondary ion mass spectroscopy. The surface layer recombination lifetime in p/p+ epitaxial Si is unaffected by the Co at doses of 1×1011 cm−2 or 1×1012 cm−2. In the case of 2.5 MeV, 4×1014 B/cm2 ion implanted bulk Si, two mechanisms for Co redistribution during high temperature furnace, 900 °C, 30 min, processing are evident. First, regions of high boron concentration provide gettering sites for Co contamination. Second, the final distribution of Co in Si reflects ion-implantation induced defect evolution during annealing. Both mechanisms will operate during device processing and will control the effect of the metal on the electrical properties of the Si. © 2000 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.1332828
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