ISSN:
1089-7550
Quelle:
AIP Digital Archive
Thema:
Physik
Notizen:
We have investigated the nucleation processes in chemical vapor deposition (CVD) of Si on SiO2 surfaces that were treated with different chlorosilane gases SiHnCl4−n, where n=0, 1, or 2. These gases chemisorb on the SiO2 surface in a self-limiting manner. At 493 K, the saturation coverage was reached at 4×108 L exposure for the SiH2Cl2 gas, and at 2×109 L for the SiHCl3 and SiCl4 gases. CVD of Si was carried out on the chlorosilane-saturated SiO2 surfaces using Si2H6 as a source gas at 853 K. It has been found that the SiCl4 and SiHCl3 treatments effectively passivate the nucleation centers on the SiO2 surfaces, while the SiH2Cl2 treatment drastically enhances Si nucleation. The reaction mechanisms causing these differences are discussed, considering the structural changes of the adsorbed chlorosilane fragments at the CVD temperature. Application of the SiCl4 treatment to the patterned SiO2 mask for selective-area epitaxial growth of Si is demonstrated. © 2001 American Institute of Physics.
Materialart:
Digitale Medien
URL:
http://dx.doi.org/10.1063/1.1402977
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