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  • 1995-1999  (2)
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Material
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Year
  • 1
    Electronic Resource
    Electronic Resource
    Movable microstructures made by a sub-micron LIGA process (1996)
    Springer
    Microsystem technologies 2 (1996), S. 149-152 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Movable microstructures with high aspect ratios were made with lateral dimensions down to the sub-micron domain by the LIGA process and a sacrificial layer technique. Compared to microstructures usually made by LIGA, all dimensions were reduced approximately by a factor of 10, while the aspect ratio was kept constant. The smaller resist thickness in the range of some ten micrometers allowed much lower X-ray doses and energies to be used for exposure and the absorbers with a thickness of only 3 μm to be employed. As the lateral dimensions are smaller, a much larger number of devices can be fabricated in one batch. Therefore, the production costs of deep etch X-ray lithography are reduced dramatically. Electrostatic linear actuators with lateral dimensions as small as 500 nm were manufactured to demonstrate the advantages of LIGA in sub-micron dimensions. An X-ray mask with absorbers 2.8 μm high was produced by a three-level technique. The linear actuators consisted of several arrays of capacitor plates combined into an electrostatic driving unit with an active area, typically, 0.3 mm2 and less. The driving unit was supported by folded beam flexures to avoid frictional forces. They also guaranteed parallel movement of the capacitor plates. The functionality of these devices was demonstrated by measuring displacement as a function of the voltage applied.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050033
    Library Location Call Number Volume/Issue/Year Availability
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    Paper (German National Licenses)
    Fulltext
  • 2
    Electronic Resource
    Electronic Resource
    High aspect ratio multi-level mold inserts fabricated by mechanical micro machining and deep etch X-ray lithography (1996)
    Springer
    Microsystem technologies 2 (1996), S. 174-177 
    Details
    ISSN: 1432-1858
    Source: Springer Online Journal Archives 1860-2000
    Topics: Electrical Engineering, Measurement and Control Technology , Technology
    Notes: Abstract  Complex microstructures can be fabricated in large quantities by thermoplastic molding processes. The shape of the microstructures is determined mainly by the mold insert. Until now, multi-level mold inserts have been fabricated either by deep etch X-ray lithography and electroforming, Harmening et al. (1992), or by milling of a brass substrate, Schaller et al. (1995). In both cases there are limitations on structuring either by the fabrication effort or by the sizes of the smallest available milling heads. To avoid these limitations on structuring, a new process for manufacturing multi-level mold inserts has been developed at Forschungszentrum Karlsruhe. Milling, drilling, deep etch X-ray lithography and electroforming have been combined to manufacture a mold insert which is characterized by high aspect ratios with small lateral dimensions and various level heights. Samples with two levels and an aspect ratio of 15 have been manufactured. Much higher aspect ratios seem to be achievable. This paper covers the fabrication process, first tests, and experimental results of manufacturing a multi-level mold insert for molding three-dimensional components of a microvalve system.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/s005420050039
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
    Paper (German National Licenses)
    Fulltext
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