ISSN:
1572-8838
Source:
Springer Online Journal Archives 1860-2000
Topics:
Chemistry and Pharmacology
,
Electrical Engineering, Measurement and Control Technology
Notes:
Abstract The electrolytic reduction mechanisms of K2SiF6 and K2TiF6 solutions in LiF-KF and LiF-NaF-KF eutectic mixtures have been studied at temperatures between 550 and 850°C. The reduction of K2SiF6 proceeds by two successive electron transfers, $$Si(IV) + 2e \to Si(II) + 2e \to Si$$ coupled with an antidisproportionation reaction $$Si(IV) + Si \underset{{k_b }}{\overset{{k_b }}{\longleftrightarrow}} 2Si(II)$$ Very pure thin silicon layers, up to 300 μm thick, were obtained on a silver substrate. The cathodic reduction of TiF 6 2− ions occurs in two well separated reversible steps, $$TiF_6^{2--} + e \to TiF_6^{3--} + 3e \to Ti + 6F^--$$ Adherent coatings of pure titanium were found to be linked to the copper substrate by an interdiffusion sublayer comprising Ti2Cu, TiCu, Ti2Cu3 and TiCu4 which were formed in a narrow potential domain preceding titanium deposition.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF01023295
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