Library

feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
Filter
  • 1985-1989  (4)
Material
Years
Year
  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 8 (1989), S. 137-140 
    ISSN: 1573-4811
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 23 (1988), S. 1231-1236 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract Solid-state bonding between dissimilar metals, produced at elevated temperatures with the application of a bonding pressure, causes structural changes in the microstructure of the zones nearest to the bond interface. These metallurgical transformations, produced by interdiffusion in the vicinity of the bond, decide the final properties of the joint. In the present paper, such diffusional transformations have been investigated for diffusion-bonded joints of Armco iron and copper with different oxygen contents (ETPC and OFLPC). The formation of iron oxide (wustite) has been observed in the ETPC-Armco iron joints. This oxide did not appear in OFLPC-Armco iron diffusion-bonded joints. This suggests that iron oxide forms by reaction of iron with oxygen dissolved in the ETPC base metal. The formation of copper particles in the iron base matrix, near the bond interface, has been observed. This may be due to two different processes: the solid-state precipitation of copper into iron and the eutectoid reaction (γ →ε +α) at bonding temperatures above 900° C.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 3
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 23 (1988), S. 2273-2280 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract A metallographic study of diffusion bonds between aluminium and copper has been made in order to further understanding of the mechanism of bond formation for joints between dissimilar metals that form intermediate phases or intermetallic compounds. A three-stage mechanistic model based upon sintering principles has been proposed to explain this kind of diffusion joint.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
  • 4
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 24 (1989), S. 4152-4159 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The microstructure transformations produced during the diffusion bonding of grey cast iron to pure iron (ARMCO iron) and to a hypoeutectic steel (0.55% C) have been studied. The indirect determination of the carbon concentration profiles has produced a diffusion equation that relates the microstructure of the bond interface to the bonding temperature and time. A new tensile test specimen is described; this specimen has a variable circular section which allows the determination of true tensile strength of dissimilar diffusion bonds. Metallographic and fractographic studies have shown that the optimum bonding conditions for both types of joint are a bonding temperature at 980° C, for 5 min at a bonding pressure of 4.5 MPa.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
    BibTip Others were also interested in ...
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...