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  • 1980-1984  (3)
  • Chemistry  (3)
  • Pseudomonas fluorescence
Materialart
Erscheinungszeitraum
Jahr
  • 1
    Digitale Medien
    Digitale Medien
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 29 (1984), S. 1241-1248 
    ISSN: 0021-8995
    Schlagwort(e): Chemistry ; Polymer and Materials Science
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Maschinenbau , Physik
    Notizen: Measurements of birefringence during stress-relaxation and recovery have been recorded for examples of an epoxy resin cured at three different temperatures. Birefringence remained constant during stress-relaxation even after prolonged testing during which the stress fell considerably. The stress sensitivity was found to be the same on both loading and unloading so that, immediately after unloading, the birefringence was different to that prior to the stress-relaxation test. This residual change began to decay after a prolonged period free from applied stress. No significant differences were noted in the birefringence measurements made on samples cured at different temperatures, but, when the stress-relaxation data were analyzed by the procedure of Kubát and Rigdahl, marked differences appeared.
    Zusätzliches Material: 8 Ill.
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
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  • 2
    Digitale Medien
    Digitale Medien
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 29 (1984), S. 2155-2161 
    ISSN: 0021-8995
    Schlagwort(e): Chemistry ; Polymer and Materials Science
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Maschinenbau , Physik
    Notizen: Curing stresses in sheets of an epoxy polymer cured at 80°C, 120°C, and 135°C have been determined using the layer removal procedure. Tensile stresses were found to be present in the interior and compressive stresses near to the surface in all samples. Very low stresses were found to be present in material cured at 80°C, with a maximum compressive stress level close to 0.5 MN/m2 and a maximum tensile stress close to 0.25 MN/m2. Higher stress magnitudes were obtained when using higher curing temperatures, with values of more than 1 MN/m2 (compressive) and 0.6 MN/m2 (tensile) recorded for specimens cured at 135°C.
    Zusätzliches Material: 3 Ill.
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
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  • 3
    Digitale Medien
    Digitale Medien
    Weinheim : Wiley-Blackwell
    Acta Polymerica 35 (1984), S. 667-668 
    ISSN: 0323-7648
    Schlagwort(e): Chemistry ; Polymer and Materials Science
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Physik
    Zusätzliches Material: 3 Ill.
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
    BibTip Andere fanden auch interessant ...
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