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LCVD of copper: Deposition rates and deposit shapes (1986)

Moylan, C. R. ; Baum, T. H. ; Jones, C. R.

Springer

Applied physics 40 (1986), S. 1-5

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ISSN: 1432-0630

Keywords: 81.15.Gh ; 82.30.Lp

Source: Springer Online Journal Archives 1860-2000

Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics

Notes: Abstract Laser chemical vapor deposition of copper has been performed under a variety of conditions. The results are interpreted using the kinetic model of Ehrlich and Tsao. We find that the kinetics of the process are limited by the rates of surface reactions and not by diffusion of reactant molecules to the surface. Furthermore, we find that deposit shapes are quite sensitive to laser intensity and scan rate.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1007/BF00616584

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