ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
For an ester-type photosensitive polyimide precursor of low thermal expansion coefficient, the oxygen concentration in the curing process and the molecular weight of the polyimide precursor were found to control the properties of the polyimide. The effects of these factors on the thermal expansion coefficient, tensile strength, and modulus of polyimide film were investigated. Based on these results, a photosensitive polyimide with low thermal expansion coefficient, called the PIMEL TL-series, was developed. Crack and delamination free multilayers were successfully achieved using this newly developed product.
Additional Material:
9 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760322114
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