ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
In this paper we describe the synthesis, characterization, and lithographic evaluations of novel positive photoresists based on hydroxy polyimides and polyamides containing 6-F linking groups. The polymers were synthesized using solution condensation techniques and characterized using solution viscosity, GPC, FTIR, NMR, UV, TGA, and DSC. Tg's of these polymers range from 250 to 300°C. Both polyimides and polyamides are soluble in a variety of solvents commonly utilized for photoresist applications. When formulated with diazonaphthoquinone sensitizers, these polymers provide an improved high-temperature resistant, aqueous base developable positive photoresist system with good photospeed, contrast, and resolution characteristics. High resolution relief images were obtained which are comparable to 1300 Series AZ type photoresists. No thermal deformation, loss in resolution or defects were noticed when relief patterns were annealed to 250°C. Additionally, the hydroxy polyamide based resists, when thermally annealed to 300°C, provide a photoresist system with even higher thermal stability (400 to 450°C) and excellent resistance to solvents. Also, the photoresist formulations have excellent storage stability at room temperature and can be processed like conventional positive photoresists using broad band UV radiation sources.
Additional Material:
7 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760291414
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