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  • Chemical Engineering  (1)
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    Electronic Resource
    Electronic Resource
    Brookfield, Conn. : Wiley-Blackwell
    Polymer Composites 9 (1988), S. 382-388 
    ISSN: 0272-8397
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The phenomena of dewetting in filled thermoplastics were studied by light microscopy and were correlated with variations in the slope of stress-strain diagrams in constant strain rate tests. In such diagrams, kinks in the plots were found to correspond to the dewetting stress. The corresponding local stress at a filler particle is then equal to the sum of the thermal compressive stress and the adhesion stress. It was shown that the adhesion stress was proportional to the reciprocal root of the particle radius. Also, values of dewetting stress predicted for inorganic particles with radii smaller than 2-4 micrometers are higher than the stresses at which crazes and shear-bands are formed near such particles, indicating that dewetting will not occur in those cases, and adhesion aids may be superfluous.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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