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  • 1
    Electronic Resource
    Electronic Resource
    Hoboken, NJ : Wiley-Blackwell
    AIChE Journal 33 (1987), S. 1585-1591 
    ISSN: 0001-1541
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Process Engineering, Biotechnology, Nutrition Technology
    Notes: A novel plasma-developed resist lithographic process is described that uses compressed CO2 to extract nonvolatile siloxane molecules from host organic polymers. The process is capable of at least 0.75 μm resolution with an X-ray sensitive guest siloxane-host polymer system. A processing window was investigated and defined to eliminate or minimize film damage during compressed fluid extraction. Polymer deformation was usually avoided by using supercritical CO2 rather than liquid CO2, provided that film thicknesses were ≤1 μm. Increased solute concentrations in the host polymer also adversely affected the quality of extracted films. An in situ capacitance process monitoring scheme was developed which indicated that film damage, when observed, was primarily caused by explosive decompression of the solvent from the host polymer.
    Additional Material: 11 Ill.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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  • 2
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 20 (1980), S. 1087-1092 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Relative rates of polymer removal in an oxygen plasma have been measured for 40 polymer samples. The rates of removal are correlated, with structural factors which enhance or retard removal. Strong backbone bonds, aromatic and polar functional groups, and metallic atoms decrease the removal rates. Weak bonds not attached to the- polymer backbone have little affect while weak bonds attached directly to the chain or in the chain greatly accelerate removal. Chlorine present in the polymer catalyzes removal. This can be mimicked by mixtures of CF4, and O2 for which much enhanced removal rates are observed.
    Additional Material: 4 Ill.
    Type of Medium: Electronic Resource
    Library Location Call Number Volume/Issue/Year Availability
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  • 3
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 23 (1983), S. 1029-1038 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: UV spectroscopy, gel permeation chromatography (GPC) and liquid chromatography (LC) have been used to analyze process factors that influence the properties of PDXR-2 plasma developed X-ray resist comprised of 92.5 wt percent poly(2,3-dichloro-1-propyl acrylate) and 7.5 wt percent bis-acryloxybutyltetramethyldisiloxane (BABTDS). The GPC-LC method is particularly useful in optimizing fixing conditions, determining monomer concentration in the film, and studying molecular processes caused by absorbed X-rays and thermal effects during fixing. Evidence for a synergistic sensitivity enhancement resulting from fixing and exposure is presented. Optimally processed O2 reactive-ion etch developed patterns exhibit a microgranular texture in both exposed and unexposed regions of 〈500 Å size. Unexposed region texture consists of SiO2 resulting from the BABTDS monomer. It is completely removed by reactive ion etching with CHF3 for short times at low power. The exposed area texture is not removed and affords an edge roughness per line edge of 〈500 Å. Resolution appears mask limited while granular size is dependent on exposure time. A 20 sec exposure optimizes resolution, pattern uniformity, and granularity. 0.5 μm line and space resolution can be obtained with the X-ray machine and masks currently in use.
    Additional Material: 18 Ill.
    Type of Medium: Electronic Resource
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