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  • 1990-1994  (2)
  • Chemistry  (1)
  • Electrical and Electronics Engineering  (1)
Materialart
Erscheinungszeitraum
Jahr
  • 1
    Digitale Medien
    Digitale Medien
    Chichester [u.a.] : Wiley-Blackwell
    International Journal of Numerical Modelling: Electronic Networks, Devices and Fields 3 (1990), S. 99-110 
    ISSN: 0894-3370
    Schlagwort(e): Engineering ; Electrical and Electronics Engineering
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Elektrotechnik, Elektronik, Nachrichtentechnik
    Notizen: A procedure is described for estimating various parameters governing the diffusion of impurities in semiconductors; these parameters are required for a number of explicit numerical models of non-linear diffusion in III-V crystals. The method is based on an analytical solution of the continuum equivalent of a discrete numerical model due to Zahari and Tuck and provides a systematic procedure for analysing experimental data to yield predictions for the coefficient of diffusion of the impurity, the coefficient of self-diffusion of the host material, the bulk equilibrium vacancy concentration and, under conditions of “dissociation” pressure, the surface vacancy concentration. Application of the procedure to two sets of independent experimental data provided reasonably consistent values of the parameters.
    Zusätzliches Material: 4 Ill.
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
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  • 2
    Digitale Medien
    Digitale Medien
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 45 (1992), S. 947-956 
    ISSN: 0021-8995
    Schlagwort(e): Chemistry ; Polymer and Materials Science
    Quelle: Wiley InterScience Backfile Collection 1832-2000
    Thema: Chemie und Pharmazie , Maschinenbau , Physik
    Notizen: The peel strength and the color of the copper foil peeled at 90 degrees from five different polyimide films were studied. The interfacial surfaces of copper foil and polyimide were examined by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and energy dispersion analysis by X-ray (EDAX). There is a correlation between peel strength, and the color of the interfacial side copper caused by oxygen diffusion. Study of the imidization process carried out in vacuum indicates that the geometric arrangements of the atoms of polyimide also play a very important role in peel strength.
    Zusätzliches Material: 5 Ill.
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
    BibTip Andere fanden auch interessant ...
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