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  • 1
    Electronic Resource
    Electronic Resource
    Brookfield, Conn. : Wiley-Blackwell
    Polymer Composites 10 (1989), S. 424-428 
    ISSN: 0272-8397
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Fourier transform infrared spectroscopy was utilized to characterize the interfacial bonding in glass-fiber-reinforced composites. The pH of the treating solution significantly affects the interfacial chemical bonding. The natural pH of the solution gives the maximum interfacial bonding. The decrease of the interfacial bonding is due to the side reactions that occur when NaOH or HCl is added to the solution. The temperature of the curing process has little effect on the amount of the interfacial chemical bonding. We attribute this to the reaction rate constant of the interfacial reaction being much larger than that of the epoxy polymerization. From the hygrothermal behavior, we have found the amount of silane needed for hygrothermal condition is different from that for dry condition.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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