ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Three front runners for the next generation of devices for fine line lithography are photo, electron, and X-ray lithography. Each of these techniques has both advantages and disadvantages when considered for direct wafer processing. This paper discusses the problems encountered using each of these techniques and how a trilevel technique can be applied to make each of these techniques more viable.
Additional Material:
10 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760201612
Permalink