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  • 1
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 1 (1959), S. 296-299 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Copolymers of styrene-methyl methacrylate were irradiated in vacuo with γ-rays; viscosity changes and gas yields (moles gas per mole methyl methacrylate in copolymer) for H2, CO, CO2, CH4, HCOOCH3, and CH3OH were examined at doses of 1.0 Mrep to 10.0 Mrep. It was found that styrene molecules protect the copolymer from degrading while decreasing the gas yields up to a styrene concentration of about 0.5 mole fraction; above this concentration, these radiation effects are independent of composition. When styrene-methyl acrylate copolymers were irradiated, styrene offered protection aganist gelation but simultaneously increased the gas yields (gases liberated were identical with those from the first system).
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Weinheim : Wiley-Blackwell
    Zeitschrift für anorganische Chemie 62 (1909), S. 383-394 
    ISSN: 0863-1778
    Keywords: Chemistry ; Inorganic Chemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: 1. Eine Kaliumsulfat-Schwefelsäurelösung von Niob und Tantal, zu welcher Bernsteinsäure gesetzt worden ist, kann sehr stark verdünnt und erhitzt werden, ohne dass eine unlösliche Verbindung eines dieser Elemente sich ausscheidet.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Bognor Regis [u.a.] : Wiley-Blackwell
    Journal of Polymer Science Part A: Polymer Chemistry 27 (1989), S. 1053-1063 
    ISSN: 0887-624X
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Four novel symmetric tri-n-alkyltin fluorides were prepared. In this homologous series, melting point decreases with increase in the carbon chain length while an x-ray diffraction study shows an increase in amorphousness. 1H-NMR spectra in cyclohexane, a nonpolar solvent in which these compounds form long polymeric chain, show a peak broadening effect due to high solution viscosity at very low solute concentration. Contrary to this, the spectra in CDCl3, a polar solvent in which these compounds are monomeric, show well resolved and narrow peaks. IR frequencies for Sn—C vibrations have been assigned.
    Additional Material: 5 Ill.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 1165-1168 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: A method is presented to study the mechanical behavior of soft, UV curable coating material as a function of temperature of the prepolymer at cure. For such materials, the crosslink density (hence, equilibrium modulus) is found to decrease with increasing cure temperature. The three primary coatings are: a polyurethane acrylate with a nominal equilibrium tensile modulus of 200 psi, a polyurethane acrylate with a nominal equilibrium modulus of 1200 psi, and a non-urethane acrylate with a nominal equilibrium tensile modulus of 60 psi.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
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  • 5
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Eight commercial semiconductor grade epoxy compounds that are used to encapsulate 1C (integrated circuit) devices have been evaluated for their ability to minimize the development of thermal stresses which can cause failure during device temperature cycling. Thermal expansion, dynamic modulus and adhesion studies are used to describe the mechanical interaction between the plastic package and the silicon device it surrounds. A “figure of merit” is defined for the development of stress on the 1C device as it is cooled after the packaging process. The stress is shown to be proportional to the product of three terms: (αp-αs) Ep (Tanch-T) where αp and αs are the expansion coefficients for the plastic and silicon, respectively, Ep is the modulus of the epoxy and Tanch is the temperature at which the epoxy becomes anchored to the silicon device during transfer molding. In addition, the importance of good adhesion between the epoxy encapsulant and the silicon device to prevent package cracking has been demonstrated by finite element analysis and a novel adhesion test.
    Additional Material: 16 Ill.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 1169-1171 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The strength of the bond between primary coating and glass for a dual coated lightguide may be judged by fixing the coating to a substrate and pulling the glass out. The values obtained from such measurements are shown to exhibit a temperature and rate dependence similar to the mechanical properties of the primary coating for a given coating system. Here we combined temperature and rate data for a universal description of the coating to glass adhesion for a dual coating system.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 32 (1992), S. 1163-1173 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: This paper exmines the influence of process variables on final thickness distributions for vacuum-formed thermoplastic parts. The process variables investigated include evacuation rate, sheet surface temperature, mold temperature, and material slip over the mold surface. The experimental data presented include, in addition to thicknesses, sheet surface temperature obtained via infrared thermography. A finite element program to model the vacuum-forming process is discussed, and the wall thickness distribution predicted by this program for a vacuum-formed part is compared with the results of the experiments.
    Additional Material: 16 Ill.
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 25 (1985), S. 105-112 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The frequency dependence of the complex-shear modulus of a nonbrominated flame-retardant polycarbonate has been successfully represented from 1 hertz (hz) to 1 gigahertz (ghz) at 190°C using a mechanical analog of the Cole-Cole dielectric analysis. Two sets of retardation times were required centered about 74 msec and 16 μsec. The β value for the short time response was 0.83 and for the longer time response was 0.58. The values of JoN determined from the common point at which the terminal-zone arc and the transition-zone arc touch the Jc″ = 0 axis yields an entanglement molecular weight, Me, of 1470 g/mole.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 30 (1990), S. 1314-1322 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The development of a finite element program specifically designed to simulate thermoforming in complex three-dimensional geometries is described. The large strain finite element model developed for simulating thermoforming processes is based on a total Lagrangian formulation which results in a nonlinear system of equations that must be solved iteratively. The nonlinear material behavior and contact between the polymer and mold surf aces ieads to additional complications in the numerical solution of the thermoforming simulation problem. In an effort to verify the accuracy of the finite element model developed in this study, analyses are compared with measurements obtained from three-dimensional three-formed parts.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    Hoboken, NJ : Wiley-Blackwell
    Journal of Polymer Science 41 (1959), S. 547-549 
    ISSN: 0022-3832
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Additional Material: 2 Ill.
    Type of Medium: Electronic Resource
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