ISSN:
0029-5981
Schlagwort(e):
Engineering
;
Engineering General
Quelle:
Wiley InterScience Backfile Collection 1832-2000
Thema:
Mathematik
,
Technik allgemein
Notizen:
This paper is devoted to the numerical analysis of bidimensional bonded lap joints. For this purpose, the stress singularities occurring at the intersections of the adherend-adhesive interfaces with the free edges are first investigated and a method for computing both the order and the intensity factor of these singularities is described briefly. After that, a simplified model, in which the adhesive domain is reduced to a line, is derived by using an asymptotic expansion method. Then, assuming that the assembly debonding is produced by a macro-crack propagation in the adhesive, the associated energy release rate is computed. Finally, a homogenization technique is used in order to take into account a preliminary adhesive damage consisting of periodic micro-cracks. Some numerical results are presented.
Zusätzliches Material:
21 Ill.
Materialart:
Digitale Medien
URL:
http://dx.doi.org/10.1002/nme.1620350606
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