Bibliothek

feed icon rss

Ihre E-Mail wurde erfolgreich gesendet. Bitte prüfen Sie Ihren Maileingang.

Leider ist ein Fehler beim E-Mail-Versand aufgetreten. Bitte versuchen Sie es erneut.

Vorgang fortführen?

Exportieren
  • 1
    Digitale Medien
    Digitale Medien
    Amsterdam : Elsevier
    Solid State Ionics 74 (1994), S. 75-84 
    ISSN: 0167-2738
    Schlagwort(e): Diffusion, MIEC ; Oxygen membranes ; Porous electrodes ; surface exchange
    Quelle: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Thema: Physik
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
    BibTip Andere fanden auch interessant ...
  • 2
    Digitale Medien
    Digitale Medien
    Springer
    International journal of fracture 101 (2000), S. 161-180 
    ISSN: 1573-2673
    Schlagwort(e): Micromechanical modeling ; cohesive force ; fracture ; heterogeneous materials ; elasticity ; fracture modes ; failure modes ; numerical simulation ; crack propagation ; ceramic composites.
    Quelle: Springer Online Journal Archives 1860-2000
    Thema: Maschinenbau
    Notizen: Abstract A micromechanical model that provides explicit accounts for arbitrary microstructures and arbitrary fracture patterns is developed and used. The approach uses both a constitutive law for the bulk solid constituents and a constitutive law for fracture surfaces. The model is based on a cohesive surface formulation of Xu and Needleman and represents a phenomenological characterization for atomic forces on potential crack/microcrack surfaces. This framework of analysis does not require the use of continuum fracture criteria which assume, for example, the existence of K-fields. Numerical analyses carried out concern failure in the forms of crack propagation and microcrack formation. Actual microstructures of brittle alumina/titanium diboride (Al2O3/TiB2) composites are used. The results demonstrate the effects of microstructure and material inhomogeneities on the selection of failure modes in this material system. For example, the strength of interfaces between the phases is found to significantly influence the failure characteristics. When weak interfacial strength exists, interfacial debonding and microcrack initiation and growth are the principal mode of failure. When strong interfacial strength is derived from material processing, advancement of a dominant crack and crack branching are observed.
    Materialart: Digitale Medien
    Bibliothek Standort Signatur Band/Heft/Jahr Verfügbarkeit
    BibTip Andere fanden auch interessant ...
Schließen ⊗
Diese Webseite nutzt Cookies und das Analyse-Tool Matomo. Weitere Informationen finden Sie hier...