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  • thermal stress  (1)
  • 1
    Electronic Resource
    Electronic Resource
    Springer
    International journal of fracture 96 (1999), S. 179-201 
    ISSN: 1573-2673
    Keywords: dissimilar materials, stress singularity ; thermal stress ; compressive stress ; logarithmic singularity.
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract The characteristics of stress singularities near the free edge of the interface of bonded dissimilar materials subjected to change in temperature are investigated. The thermal stresses are represented by the sum of the singular terms of types r-1 and log r, no singular ones and the particular ones. The functions, K × F (j=1,2,3), associated with the terms except the particular terms contributing to the thermal stresses are described as new stress intensity factors. The K is obtained from the technique of the Mellin transform and the F is calculated by numerical analysis such as finite element analysis. The emphasis here is placed on clarifying material combinations with arbitrary wedge angles and elastic properties yielding K = 0. The results can be used to determine material/geometry which ensures that interface residual stresses will be in compressive.
    Type of Medium: Electronic Resource
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