ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
This paper deals with a novel polishing technology using polymer particles. It has beenproposed and developed by the authors for the purpose of solving the problems associated withpolishing pads such as pad deterioration, process inconsistency and poor accuracy. Single sidepolishing of silicon wafers and double side polishing of quartz crystal square wafers wereperformed to clarify the basic characteristics of the technology. The results showed that appropriatecombination of tool plate with polymer particles could greatly improve polishing characteristics.In particular, the edge profiles can be controlled to have desirable shape as well as amplitudes
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/53/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.339.263.pdf
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