ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Physical aging of a thermoset system based on bisphenol-A epoxy (DERTrademark of The Dow Chemical Company. 383) and tetrabromobisphenol-A cured with sulfanilamide and diaminodiphenylsulfone was studied as a function of cure history. Changes in the dynamic mechanical spectra for the thermoset system were correlated to changes in relative toughness associated with physical aging as determined by plane-strain biaxial tension-compression yield measurements. It was found that master curves, generated by using tan δ data obtained in the β relaxation temperature regime, are well related to the corresponding changes in mechanical properties and, hence, have predictive value. Relative toughness decreases and compressive yield increases with decreasing tan 5 because of decreased molecular segmental mobility. The relative extent of physical aging for the as-cast thermosets was shown to be linearly related to the cure time.
Additional Material:
9 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760280102
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