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Stress measurement by copper electroplating aided by a personal computer

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Abstract

An image-processing system using a personal computer was applied to stress measurement by copper electroplating. The microscopic TV image of the plating structure of an electroplated specimen after cyclic loading was directly analyzed by the image-processing system. The density of grains grown in the plated layer was measured automatically. The surface stress of the specimen can be estimated based on the grain density. The stress-concentration factors of grooved shafts under torsion were obtained as an example of application. The result was in good agreement with the numerical values published previously.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Chubu University, 487, Kasugai, Aichi, Japan

    Akira Kato (Associate Professor)

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  1. Akira Kato
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Kato, A. Stress measurement by copper electroplating aided by a personal computer. Experimental Mechanics 27, 132–137 (1987). https://doi.org/10.1007/BF02319464

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  • DOI: https://doi.org/10.1007/BF02319464

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