Abstract
Plating fog is often observed when metallizing a latent pattern by electroless copper plating. Metallic elements in the nuclei of plating fog particles are analysed using electron probe microanalysis (EPMA). Silver and iron are invariably found in the particles. The iron is driven into the board during the liquid honing process and reduces silver ions in the photosensitive material to silver metal which causes plating fog. Plating fog also arises from reduced copper particles or generated hydrogen gas bubbles when they are trapped on the unpatterned region. Mechanical stirring accompanied by substrate oscillation is an effective method of avoiding plating fog.
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References
H. Tabei, S. Nara and K. Matsuyama, J. Electrochem. Soc. 121 (1974) 67.
A. Iwasawa, H. Tabei, S. Nara and K. Matsuyama, Photographic Sci. Eng. 20 (1976) 246.
S. Sugihara, A. Iwasawa, H. Tabei and J. Yamaki, J. Chem. Soc. Japan (1994) 617.
S. Sugihara, A. Iwasawa and A. Tanaka, Kobunshi Ronbunshu 39 (1982) 115.
S. Sugihara, J. Adhesion Soc. Japan 13 (1995) 12.
Idem, ibid. 13 (1995) 76.
S. P. Poa, C. C. Wan and C. J. Wu, Metal Finish. 8 (1977) 13.
H. M. Ghorashi, Plat. & Surf. Finish. 64 (1977) 42.
S. Nara, H. Tabei, K. Onose and A. Iwasawa, Electr. Commun. Laboratories Techn. J. 25 (1977) 617.
A. Iwasawa, H. Tabei, S. Nara, S. Sugihara and K. Onose, Rev. Electr. Commun. Laboratories 25 (1977) 570.
S. Sugihara, A. Iwasawa, K. Onose and J. Yamaki, J. Appl. Electrochem. 26 (1996) 63.
L. J. Dragosavic and N. Cikovic, Galvanotechnik 80 (1989) 4434.
L. J. Dragosavic and N. Cikovic, ibid. 81 (1990) 624.
M. Saito and H. Honma, J. Metal Finish. Soc. Japan 29 (1978) 88.
R. M. Lukes, Plating 51 (1964) 1066.
H. Hirohata, M. Oita and K. Honjo, J. Metal Finish. Soc. Japan 21 (1970) 20.
L. N. Schönberg, J. Electrochem. Soc. 119 (1972) 1491.
M. Saito, J. Metal Finish. Soc. Japan 17 (1966) 258.
E. B. Saubestre, Plating 59 (1972) 563.
S. Konishi, J. Metal Finish. Soc. Japan 16 (1965) 503.
A. I. Vashkyalis, Zashchita Metallov 3 (1967) 472.
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SUGIHARA , S., IWASAWA , A., ONOSE , K. et al. Plating fog generation in the forming of printed circuits by the additive method. Journal of Applied Electrochemistry 27, 1111–1117 (1997). https://doi.org/10.1023/A:1018403130015
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DOI: https://doi.org/10.1023/A:1018403130015