Abstract
A systematic method has been used to characterize a particular grain boundary in a Cu-Ni alloy. Its multiplicity is ∑=27a and a deviation from that orientation has been calculated and expressed by a small-angle rotation matrix. The deviation angle of 50′ has been calculated by electron diffraction patterns and also on the basis of the intrinsic dislocation structure. These have been found to be of the same type as the matrix dislocations, having also a relation to the ∑=276a orientation relationship.
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G. L. Bleris, Th. Karakostas andP. Delavignette, to be published.
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Karakostas, T., Bleris, G.L., Antonopoulos, J.G. et al. A ∑=27 coincidence grain boundary in a Cu-Ni alloy. J Mater Sci 17, 3361–3370 (1982). https://doi.org/10.1007/BF01203506
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DOI: https://doi.org/10.1007/BF01203506