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Lee, T.W., Kim, I.K., Lee, C.H. et al. Growth behavior of intermetallic compound layer in sandwich-type Ti/Al diffusion couples inserted with Al-Si-Mg alloy foil. Journal of Materials Science Letters 18, 1599–1602 (1999). https://doi.org/10.1023/A:1006616502733
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DOI: https://doi.org/10.1023/A:1006616502733