Summary
To better understand the curing and bonding behavior of phenol-formaldehyde (PF) resin under dynamic conditions, flakeboards were manufactured either by conventional pressing at 7% or 12% mat moisture content or by steam injection pressing with 10 or 20 seconds steaming duration. Resin-impregnated glass-cloth samples and lap-shear tension specimens were embedded in the core of each flakeboard. After the flakeboards were pressed for various periods of times, the samples and specimens were quickly retrieved. The degree of resin cure was determined on the resin-impregnated glass-cloth samples by dynamic mechanical analysis. The bond strengths were measured from the lap-shear tension specimens on a mechanical testing machine. The results of resin curing and bonding were then correlated to the performance of the resin-bonded boards, which were evaluated by internal bond, modulus of rupture, modulus of elasticity, and thickness swelling. Resin curing and lap-shear bonding did not proceed simultaneously. In conventional pressing, the mat moisture content (MC) at 12% favored resin curing, but slightly retarded lap-shear bonding, as compared to 7%MC. In steam injection pressing, the rates of resin curing and lap-shear bond strength development were much faster for 20 seconds than for 10 seconds of steaming duration. Longer press times were needed to obtain boards with maximum strength in the 12%MC conventional pressing and the 20-s steam duration steam injection pressing than in those conditions where moisture content was lower or steam time was less. The need for longer press times must be attributed to higher internal vapor pressures and/or lower wood and resin component strengths, rather than to incomplete cure or bonding.
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This material is based on work supported by the Ministry of International Affairs, Quebec Government, the Natural Sciences and Engineering Research Council of Canada, and Laval University (Quebec City). The work was also supported by the U.S. Department of Agriculture under research joint venture agreement FP-92-1835
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Wang, XM., Riedl, B., Geimer, R.L. et al. Phenol-formaldehyde resin curing and bonding under dynamic conditions. Wood Sci.Technol. 30, 423–442 (1996). https://doi.org/10.1007/BF00244438
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DOI: https://doi.org/10.1007/BF00244438